Abstract
The introduction of planar technology in 1959 dramatically reduced the price of semiconductor components and, as a result, encapsulation costs became a significant proportion of the total. At that time most components were hermetically packaged, but by 1962 the pressures to make some high-volume production items less expensive led to the development of plastic encapsulation. Since then the use of plastic encapsulation has increased to the extent that over 90% of all semiconductor products are now supplied in this form.
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References
Taylor, C. H., Plastic encapsulated semiconductor devices—bibliography III,Microelectron. Reliab.,19(1979) 403.
Schnable, G. L. and Comizzoli, R. B., CMOS integrated circuit reliability,Microelectron. Reliab.,21(1981) 33.
Berg, H. M. and Paulson, W. M., Chip corrosion in plastic packages,Microelectron. Reliab.,20(1980) 247.
Reynolds, F. H., Thermally accelerated aging of semiconductor components,Proc. IEEE,62(1974) 149.
Gale, R. J., Epoxy degradation induced Au-Al intermetallic void formation in plastic encapsulated MOS memories,Reliability Physics Symposium Proceedings,22(1984) 37.
Schroen, W. H., Spencer, J. L., Bryan, J. A., Cleveland, R. D., Metzgar, T. D. and Edwards, D. R, Reliability tests and stress in plastic encapsulated circuits,Reliability Physics Symposium Proceedings,19(1981) 81.
Ubbing, J., Mechanisms of temperature cycle failure in encapsulated optoelectronic devices,Reliability Physics Symposium Proceedings,19(1981) 149.
Harrison, J. C., Control of the encapsulation material as an aid to long term reliability in plastic encapsulated semiconductor components,Microelectron. Reliab.,16(1977) 233.
Sim, S. P. and Lawson, R. W., The influence of plastic encapsulants and passivation layers on the corrosion of thin aluminium films subjected to humidity stress,Reliability Physics Symposium Proceedings,17(1979) 103.
Lawson, R. W., The accelerated testing of plastic encapsulated semiconductor components,Reliability Physics Symposium Proceedings,12(1974) 243 – 9.
Lawson, R. W., A review of the status of plastic encapsulated semiconductor component reliability,British Telecom Technol. J.,2(1984) 95.
Sbar, N. L. and Kozakiewicz, R. P., New acceleration factors for temperature, humidity, bias testing,IEEE Trans. Electron Devices,ED-26(1979) 56.
Merrett, R. P., Bryant, J. P. and Studd, R., An appraisal of high temperature humidity stress tests for assessing plastic encapsulated semiconductor components,Reliability Physics Symposium Proceedings,21(1983) 73.
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© 1985 Elsevier Applied Science Publishers Ltd.
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Merret, R.P. (1985). Plastic Encapsulated Device Reliability. In: Goosey, M.T. (eds) Plastics for Electronics. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-4942-3_6
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DOI: https://doi.org/10.1007/978-94-009-4942-3_6
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-8690-5
Online ISBN: 978-94-009-4942-3
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