Epoxide Resins and their Formulation



The epoxide resins are a class of materials that possess all the properties required to make them useful for a wide range of applications throughout the electronics industry. They have good electrical properties, low shrinkage, good adhesion and resistance to thermal and mechanical shock, whilst also possessing resistance to moisture, solvents and general chemical attack.


Flame Retardant Epoxide Group Phthalic Anhydride High Glass Transition Temperature Glycidyl Ether 
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Further Reading

  1. Abshier, C. S., Berry, J. and Maget, H. J. R., Toughening agents improve epoxy encapsulants.Insulation/Circuits,27(Oct. 1977).Google Scholar
  2. Anon. Flame retardants.European Plastics News,10(Nov. 1982).Google Scholar
  3. Bruins, P. F. (Ed.),Epoxy Resin Technology. 1968, John Wiley and Sons Inc., New York.Google Scholar
  4. Buttrey, D. N.,Plasticisers. 1960, Franklin Publishing Company, Inc., Palisade (New Jersey).Google Scholar
  5. Hirsch, H., Resin systems used for encapsulation of microelectronic packages.Proc. Soc. Plastics Engineers, 28th Annual Technical Conference, 380 ( May 1970 ), New York.Google Scholar
  6. Katz, H. S. and Milewski, J. V.,Handbook of Fillers and Reinforcements for Plastics. 1978, Van Nostrand Reinhold Company, New York.Google Scholar
  7. Keirsey, R. A., Evolution of epoxy resins in semiconductor device encapsula’tion. Ann. Pack. Tech. Conf. Disp. (Tech. Pap), Society of Plast. Eng.,19816th Reinforced Plast. Comp. Adhes. Thermosets, pp. 172–9.Google Scholar
  8. Lee, H. and Neville, K.,Handbook of Epoxy Resins. 1967, reissue 1982, McGraw-Hill, New York.Google Scholar
  9. Lyons, J. W.,The Chemistry and Uses of Fire Retardants. 1970, John Wiley and Sons Inc., New York.Google Scholar
  10. Markstein, H. W., The use of plastics and resins in electronics.Electronic Packaging and Production,51(Aug. 1981).Google Scholar
  11. Nielson, P. O., Properties of epoxy resins, hardeners, and modifiers.AdhesivesAge,42(April 1982).Google Scholar
  12. Oldberg, R. C., The effects of epoxy encapsulant composition on semiconductor device stability.J. Electrochem Soc: Solid State Science,118, 129 (Jan. 1971).Google Scholar
  13. Potter, W. G.,Epoxide Resins. 1970, Butterworth and Co. (Publishers) Ltd., London.Google Scholar
  14. Reinhart, J., Epoxy moulding compounds for semiconductor encapsulation.Circuits Manufacturing,29(Aug. 1977).Google Scholar
  15. Schultz, N., Potting and encapsulating electronic components.Adhesives Age,19(July 1983).Google Scholar
  16. Snyder, P. M., Developments in semiconductor device encapsulation,Microelectronic Manufacturing and Testing,41(Sept. 1983).Google Scholar
  17. Suzuki, H., Sato, M., Muroi, T. and Watanabe, Y.,New Moulding Compounds for Electronic Devices. Soc. Plast. Eng. Tech. Paper 19, 6 (1973).Google Scholar

Copyright information

© Elsevier Applied Science Publishers Ltd. 1985

Authors and Affiliations

  1. 1.Dynachem CorporationTustinUSA

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