Abstract
Polymers are widely used as plastics, rubbers, fibres, adhesives, paints and sealants and their use has extended into the field of electronics, where they are used as insulators and encapsulants. In this context they should be good electrical insulators, be free from dielectric losses over the frequency range employed and have a high dielectric strength. Further they should be able to protect electronic components from their surroundings and this in turn depends on them having low permeability to atmospheric vapours and gases, and having good adhesion to the substrate. It is thus the aim of this chapter to explain the chemical and physical structures of polymers and to show how these control their electrical, barrier and adhesive properties.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Brydson, J. A.,Plastics Materials, 4th edn, Butterworth Scientific, London, 1982.
Brandrup, J. and Immergut, E. H.,Polymer Handbook, Wiley-Interscience, New York, 1975.
Elias, H. G.,Macromolecules, 2 volumes, Plenum Press, New York, 1977.
Young, R. J.,Introduction to Polymers, Chapman and Hall, London and New York, 1981.
Cowie, J. M. G.,Polymers: Chemistry and Physics of Modern Materials, Intertext Books, Aylesbury, 1973.
Odian, G.,Principles of Polymerization, 2nd edn, John Wiley and Sons, London, 1981
Fox, T. G.,Bull Amer. Phys. Soc.,1(1956) 123.
Brewis, D. M., Comyn, J., Shalash, R. J. A. and Tegg, J. L.,Polymer,21(1980) 357.
Meares, P.,Polymers: Structure and Bulk Properties, Van Nostrand Co. Ltd., London, 1965.
Mascia, L.,The Role of Additives in Plastics, Edward Arnold, London, 1974.
Blythe, A. R.,Electrical Properties of Polymers, Cambridge University Press, Cambridge, 1979.
McCrum, N. G., Read, B. E. and Williams, G.,Anelastic and Dielectric Effects in Polymeric Solids, John Wiley & Sons, London, 1967.
Crank, J.,The Mathematics of Diffusion, 2nd edn, Oxford University Press, Oxford, 1975.
Carslaw, H. S. and Jaeger, J. C.,Conduction of Heat in Solids, 2nd edn, Oxford University Press, Oxford, 1959.
Comyn, J., In:Durability of Structural Adhesives, (A. J. Kinloch (Ed.)), Applied Science Publishers Ltd, London, 1983.
Cope, B. C., PhD thesis, Leicester Polytechnic, 1977.
Brewis, D. M., Comyn, J., Cope, B. C. and Moloney, A. C.,Polymer,21(1980) 345.
Goosey, M. T., PhD thesis, Leicester Polytechnic, 1982.
Manson, J. A. and Chiu, E. H.,J. Polym. Sci., Symposium No.41, p. 95 (1973).
Meares, P.,J. Amer. Chem. Soc.,76(1954) 3415.
Peters, R. H.,Textile Chemistry. Vol III, The Physical Chemistry of Dyeing, Elsevier,Amsterdam, 1975.
Kinloch, A. J.,J. Mater. Sci.,15(1980) 2141.
Wake, W. C.,Polymer,19(1978) 291.
Wake, W. C.,Adhesion and the Formation of Adhesives, 2nd edn, Applied Science Publishers Ltd, London, 1982.
Good, R. J., In:Treatise on Adhesion and Adhesives. Vol 1 Theory, (R. L. Patrick (Ed.)), Edward Arnold, London, 1967.
Brewis, D. M.,Surface Analysis and Pretreatment of Plastics and Metals, Applied Science Publishers Ltd, London, 1982.
Butt, R. I. and Cotter, J. C.,J. Adhesion,8(1976) 11.
Gettings, M. and Kinloch, A. J.,J. Mater. Sci.,12(1977) 2511.
Walker, P.,J. Coat. Tech.,52(1980) 49.
Walker, P.,J. Oil Col Chem. Assoc.,65(1982) 415.
Walker, P.,J. Oil Col Chem. Assoc.,65(1982) 436.
Plueddemann, E. P.,Silane Coupling Agents, Plenum Press, New York, 1982.
Derjaguin, B. Y. and Smilga, V. P.,Adhesion, Fundamentals and Practice, McLaren & Son, London, 1969.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1985 Elsevier Applied Science Publishers Ltd.
About this chapter
Cite this chapter
Comyn, J. (1985). Fundamental Properties of Polymers for Electronic Applications. In: Goosey, M.T. (eds) Plastics for Electronics. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-4942-3_2
Download citation
DOI: https://doi.org/10.1007/978-94-009-4942-3_2
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-8690-5
Online ISBN: 978-94-009-4942-3
eBook Packages: Springer Book Archive