Abstract
Efficient transmission of ultrasonic radiation between two solids relies on the properties of the bond or adhesive layer between them. Ihermocompression indium bonding in vacuum is a well known technique for producing acoustically transparent bonds. We have developed a new bonding technique with indium at atmospheric pressure. Measurements on the acoustic and mechanical characteristics of such bonds are presented. It is shown that when bonding a transducer, at frequencies in the range of 100 MHz, indium bonds have considerable advantages over organic adhesive bonds.
A new form of microscopy (scanning acoustic microscopy) based upon imaging with ultrasonic waves has come into existence in recent years. One of the major applications of the acoustic microscope is nondestructive imaging through optically opaque solids, with high spatial resolution. The operation principle of the acoustic microscope is outlined and example micrographs, obtained from a range of metallic bonds, are presented.
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© 1984 Elsevier Applied Science Publishers Ltd
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Frew, H.S., Johal, B.S., Nikoonahad, M. (1984). Formation of indium bonds for ultrasonic systems and examination of metal diffusion bonds by scanning acoustic microscopy. In: Allen, K.W. (eds) Adhesion 9. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-4938-6_4
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DOI: https://doi.org/10.1007/978-94-009-4938-6_4
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-8688-2
Online ISBN: 978-94-009-4938-6
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