Abstract
Details pertaining to high and low pressure reactive ion etching (RIE) of GaAs, InP and InGaAs are discussed. Attention is given to elaborating the role of ion bombardment and chemical reaction in dry etching of these compound semiconductors. Both high pressure (≥0.1 Torr) and low pressure (1–100 mTorr) experiments are outlined using the dark space DC bias voltage to characterize the etch. Surface analysis of etched GaAs and InP using AES, photoluminescence and EDX is used to establish the role of impurities related to changes in surface morphology and chemical changes due to RIE.
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© 1986 Martinus Nijhoff Publisher
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Dzioba, S. (1986). Reactive Ion Etching of GaAs and Related III-V Compounds. In: Kiriakidis, G., Carter, G., Whitton, J.L. (eds) Erosion and Growth of Solids Stimulated by Atom and Ion Beams. NATO ASI Series, vol 112. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-4422-0_17
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DOI: https://doi.org/10.1007/978-94-009-4422-0_17
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-8468-0
Online ISBN: 978-94-009-4422-0
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