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On The Modification of Metal/Ceramic Interfaces by Low Energy Ion/Atom Bombardment During Film Growth

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Erosion and Growth of Solids Stimulated by Atom and Ion Beams

Part of the book series: NATO ASI Series ((NSSE,volume 112))

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Abstract

Elemental Cu and Ti films have been deposited onto ceramic substrates with a plasma-aided physical vapor deposition (ion-plating) process. This paper discusses how the structure and chemistry of the metallic film and the metal/ceramic interface are modified by low energy ion and neutral atom bombardment. Emphasis is placed on determining how low energy ion/neutral atom bombardment affects the strength of the metal/ceramic interface. Analyses of the film, interface and substrate regions have employed scanning Auger microprobe, secondary ion mass spectroscopy, SEM/STEM-energy dispersive x-ray and TEM/STEM imaging and microdiffraction techniques.

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Author information

Authors and Affiliations

  1. Department of Metallurgy and Mining Engineering, University of Illinois at Urbana-Champaign, 1304 W. Green Street, Urbana, Illinois, 61801, USA

    J. M. Rigsbee, P. A. Scott & R. K. Knipe

  2. Engineering and Materials Division, U.S. Army Corps of Engineers CERL, Champaign, Illinois, 61820, USA

    V. F. Hock

Authors
  1. J. M. Rigsbee
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  2. P. A. Scott
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  3. R. K. Knipe
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  4. V. F. Hock
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Editor information

Editors and Affiliations

  1. Physics Department, University of Crete, Heraklion, Crete, Greece

    G. Kiriakidis

  2. Department of Electronic and Electrical Engineering, University of Salford, Salford, UK

    G. Carter

  3. Physics Department, Queen’s University, Kingston, Canada

    J. L. Whitton

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© 1986 Martinus Nijhoff Publishers, Dordrecht

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Rigsbee, J.M., Scott, P.A., Knipe, R.K., Hock, V.F. (1986). On The Modification of Metal/Ceramic Interfaces by Low Energy Ion/Atom Bombardment During Film Growth. In: Kiriakidis, G., Carter, G., Whitton, J.L. (eds) Erosion and Growth of Solids Stimulated by Atom and Ion Beams. NATO ASI Series, vol 112. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-4422-0_15

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  • DOI: https://doi.org/10.1007/978-94-009-4422-0_15

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-8468-0

  • Online ISBN: 978-94-009-4422-0

  • eBook Packages: Springer Book Archive

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