Abstract
The rigid structure of heat resistant polymers is a drawback for structural applications because these high molecular weight heterocyclic polymers do not melt or exhibit very high Tg.
This consideration explain the development of a new type of low molecular weight telechelic aromatic oligomers which crosslink by addition polymerization when they are heated.
Three main points have to be considered:
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the melting point Mp or initial Tg of the resine
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the reaction temperature
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the Tg of the final crosslinked network
The chemical structure and the molecular weight of the central moiety will govern the initial Tg or Mp and also affect the reaction temperature.
We will briefly discuss the state of the art concerning the reaction of telechelic oligomers containing nadimide, acetylene and phthalonitrile with special emphasis on phthalonitrile resins.
As a conclusion, the telechelic oligomers approach seems a promising solution to the problem of the processability of heat resistant polymers.
However, it is important to point out the lack of information concerning the polymerization mechanism, the structure and the mechanism of degradation of these thermostable networks.
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Sillion, B. (1987). Polymerization of Reactive Telechelic Oligomers. Formation of Thermostable Networks.. In: Fontanille, M., Guyot, A. (eds) Recent Advances in Mechanistic and Synthetic Aspects of Polymerization. NATO ASI Series, vol 215. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-3989-9_18
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DOI: https://doi.org/10.1007/978-94-009-3989-9_18
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