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Ultrasonic Exploration of Adhesive Bonds by Acoustic Microscopy

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Adhesion 11

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Abstract

The acoustic scanning microscope is a new high resolution instrument for non-destructive evaluation and testing.

The principles and applications of acoustic microscopy will be described in detail and the application to adhesive bonding will be illustrated. The samples investigated include epoxy bonded aluminium plates with deliberate disbonds, die attach problems in the semiconductor industry and delamination studies of carbon fibre/epoxy composites.

Aluminium plates were subjected to various surface treatments and known polytetrafluoroethylene (PTFE) defects introduced into the bond layer. These defects, together with the spacing mesh were resolved and the influence of surface treatments upon the resulting micrographs discussed.

Unlike other non-destructive testing methods precise information regarding the location and depth where defects occur can be obtained.

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References

  1. M.G. Silk “Ultrasonic Transducers for non-destructive testing”. Adam Hilger Ltd., Bristol 1984.

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  2. C.R. Petts and H.K. Wickramasinghe. Elec Lett. 1980, 16 (1), 9.

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  3. C.F. Quate. et al. Proc IEEE 1979, 67 (8) 1092.

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  4. Work undertaken at VG Semicon.

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  5. Chapter 4 in “Acoustic and Photoacoustic Microscopy” by R.C. Bray. C.L. Report No. 3243. March 1981. Stanford U.Cal.

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Author information

Authors and Affiliations

  1. VG Semicon Limited, Birches Industrial Estate, Imberhorne Lane, East Grinstead, West Sussex, RHl9 1XZ, UK

    Dominika M. Thaker & Nigel J. Burton

Authors
  1. Dominika M. Thaker
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  2. Nigel J. Burton
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Editor information

Editors and Affiliations

  1. Adhesion Science Group, The City University, London, UK

    K. W. Allen

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© 1987 Elsevier Applied Science Publishers Ltd

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Thaker, D.M., Burton, N.J. (1987). Ultrasonic Exploration of Adhesive Bonds by Acoustic Microscopy. In: Allen, K.W. (eds) Adhesion 11. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-3433-7_4

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  • DOI: https://doi.org/10.1007/978-94-009-3433-7_4

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-8036-1

  • Online ISBN: 978-94-009-3433-7

  • eBook Packages: Springer Book Archive

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