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Reactive Ion Beam Etching Studies of Tungsten with CF4 Using Ion Scattering Spectroscopy

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Plasma-Surface Interactions and Processing of Materials

Part of the book series: NATO ASI Series ((NSSE,volume 176))

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Abstract

Reactive ion beam etching (RIBE) offers intrinsic interest as an etch technique and its comparatively low operating pressure (10-4 torr in the bombardment chamber) allows the application of ion beam based surface analytical techniques to monitor the surface during etching. We report here on the RIBE of tungsten with a reactive ion beam generated from a carbon tetrafluoride (CF4)/argon (Ar) gas mixture.

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Author information

Authors and Affiliations

  1. Royal Signals and Radar Establishment, St Andrew’s Road, Great Malvern, Worcestershire, WR14 3PS, UK

    T. I. Cox & V. G. I. Deshmukh

  2. Department of Electronic and Electrical Engineering, University of Salford, Salford, M5 4WT, UK

    D. G. Armour

Authors
  1. T. I. Cox
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  2. V. G. I. Deshmukh
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  3. D. G. Armour
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Editor information

Editors and Affiliations

  1. Microelectronics Center of North Carolina, Research Triangle Park, North Carolina, USA

    Orlando Auciello

  2. North Carolina State University, Research Triangle Park, North Carolina, USA

    Orlando Auciello

  3. University of Alicante, Alicante, Spain

    Jose Antonia Valles-Abarca

  4. AT&T Bell Laboratories, Murray Hill, New Jersey, USA

    Daniel L. Flamm

  5. University of California, Berkeley, USA

    Daniel L. Flamm

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© 1990 Kluwer Academic Publishers

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Cox, T.I., Deshmukh, V.G.I., Armour, D.G. (1990). Reactive Ion Beam Etching Studies of Tungsten with CF4 Using Ion Scattering Spectroscopy. In: Auciello, O., Gras-Marti, A., Valles-Abarca, J.A., Flamm, D.L. (eds) Plasma-Surface Interactions and Processing of Materials. NATO ASI Series, vol 176. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-1946-4_21

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  • DOI: https://doi.org/10.1007/978-94-009-1946-4_21

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-7369-1

  • Online ISBN: 978-94-009-1946-4

  • eBook Packages: Springer Book Archive

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