Abstract
When an energetic atom or ion hits a solid surface, atoms, molecules and clusters may be ejected as a consequence of the energy and momentum deposited in the solid. This phenomenon is known as sputtering and has been first described in 1853, when a glow discharge cathode was pulverized.1 Sputtering constitutes a process that is of considerable importance in the field of glow discharges, plasma treatment of materials, and plasma deposition techniques, cf. elsewhere in these proceedings.2
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Urbassek, H.M. (1990). The Physics of the Sputter Erosion Process. In: Auciello, O., Gras-Marti, A., Valles-Abarca, J.A., Flamm, D.L. (eds) Plasma-Surface Interactions and Processing of Materials. NATO ASI Series, vol 176. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-1946-4_15
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DOI: https://doi.org/10.1007/978-94-009-1946-4_15
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