Abstract
In this paper some thermal problems related to modern microtechnology will be discussed. First example presents a design process of an integrated micropump. The general thermomechanical model is proposed. As the second example, the possible sources of heat generation in silicon micromotor will be discussed. The third example concerns the integrated CMOS thermal sensor designed in order to detect the high temperature rise in VLSI or Smart Power devices.
This work was supported by European Community Basic Research Project ESPRIT (no 8173 — BARMINT), and European Community Project COPERNICUS (no CP-940922 — THERMINIC)
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© 1996 Kluwer Academic Publishers
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Napieralski, A. (1996). Microtechnology — Thermal Problems in Micromachines, ULSI & Microsensors Design. In: Luryi, S., Xu, J., Zaslavsky, A. (eds) Future Trends in Microelectronics. NATO ASI Series, vol 323. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-1746-0_36
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DOI: https://doi.org/10.1007/978-94-009-1746-0_36
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