Abstract
Since the early 1970’s, silicon integrated circuit technology has been propelled by continual and successful efforts to reduce the active channel length of MOSFET devices [1–3]. This exercise in scaling provides the framework that has produced increases in the density of devices on a chip, increases in device frequency response and operating speed, and increases in the precision required to achieve more complex systems with greater functionality and performance. Today, devices with channel lengths well below 100 nm have been produced in many research laboratories, and the downward scaling trends of the past twenty years are expected to persist at the same pace until at least the 40 nm generation in manufacturing [1], or about the year 2015. This level of technology is expected to correspond to 128 GBit DRAMs and 28 Ggate microprocessors with five times the clock frequency and 1/9 the power consumption of today’s devices, all operating at a power supply voltage of around 0.5 V.
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List of References
Hiroshi Iwai, Hisayo Sasaki Momose, Masanobu Saito, Mizuki Ono, and Yasuhiro Katsumato (1995) The Future of ultra-small geometry MOSFETs beyond 0.1 micron, Microelectronics Engineering 28, 147–154.
Armin W. Weider (1995) Si-Microelectronics: Technology Perspectives-Risks, Opportunities, and Challenges (This Volume).
G. Baccarani, M. R. Wordeman, and R. H. Dennard (1984) Generalized Scaling Theory and Its Application to a 1/4 Micrometer MOSFET Design, IEEE Trans. Electron Devices ED-31, 452–459.
J. E. Chung, M.-C. Jeng, J. E. Moon, P.-K. Ko, and C. Hu (1990) Low-Voltage Hot-Electron Currents and Degradation in Deep-Submicrometer MOSFET’s, IEEE Trans. Electron Devices ED-37, 1651–1658.
David Esseni, Luca Selmi, Roberto Bez, Enrico Sangiorgi, and Bruno Ricco (1994) Bias and Temperature Dependence of Gate and Substrate Currents in n-MOSFETs at Low Drain Voltage, Proceedings of the International Electron Devices Meeting (EDM,), 307–310.
John J. Ellis-Monaghan, K. W. Kim, and Michael A. Littlejohn (1994) A Monte Carlo study of hot electron injection and interface state generation model for silicon metal-oxide-semiconductor field-effect transistors, J. Appl. Phys. 75, 5087–5094.
A. v. Schwerin and W. Weber (1995) 2-D Simulation of pMOSFET hot-carrier degradation, Microelectronic Engineering 28, 277–284.
M. Rodder, A. Amerasekera, S. Aur, and I. C. Chen (1994) A Study of Design/Process Depaendence of 0.25 µm Gate Length CMOS for Improved Performance and Reliability, Proceedings of the IEDM, 71–74.
Andrea Ghetti, Luca Selmi, Enrico Sangiorgi, Antonio Abramo, and Franco Venturi (1994) A Combined Transport-Injection Model for Hot-Electron and Hot-Hole Injection in the Gate Oxide of MOS Structures, Proceedings of the IEDM, 363–366.
S. Jallepalli, C.-F. Yeap, S. Krishnamurthy, X. L. Wang, C. M. Maziar, and A. F. Tasch Jr. (1994) Application of Hierarchical Transport Models for the Study of Deep Submicron Silicon MOSFETs, VLSI Symposium Proceedings, 91–94.
Marco Mastrapasqua and Jeff D. Bude (1995) Electron and Hole Impact Ionization in Deep Sub-micron MOSFETs, Microelectronic Engineering 28, 293–300.
K. Taniguchi, M. Yamaju, K. Sonoda, T. Kunikiyo and C. Hamaguchi (1994) Monte Carlo Study of Impact Ionization Phenomena in Small Geometry MOSFETs, Proceedings of the IEDM, 355–358.
R. B. Hulfachor, K. W. Kim, M. A. Littlejohn, and C. M. Osburn (1995) Non-Local Transport and 2-D Effects on Hot Electron Injection in Fully-Depleted 0.1 µm SOI n-MOSFETs Using Monte Carlo Simulation, Microelectronic Engineering 28, 175–182.
N. Yasuda, H. Nakamura, K. Taniguchi, and C. Hamaguchi (1989) Interface State Generation Mechanism in N-MOSFETs, Solid State Electronics 32, 1579–1586.
M. V. Fischetti and S. E. Laux (1988) Monte Carlo Analysis of Electron Transport in Small Semiconductor Devices Including Band-Structure and Space-Charge Effects, Phys. Rev. B 38, 9721–9730.
R. B. Hulfachor, K. W. Kim, M. A. Littlejohn, and C. M. Osburn (1995) A Monte Carlo Study of Drain and Channel Engineering Effects on Hot Electron Injection and Induced Device Degradation in 0.1 mm n-MOSFET’s, Fifty-Third Annual Device Research Conference (DRC) Digest, 14–15.
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© 1996 Kluwer Academic Publishers
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Hulfachor, R.B., Ellis-Monaghan, J.J., Kim, K.W., Littlejohn, M.A. (1996). Monte Carlo Simulation for Reliability Physics Modeling and Prediction of Scaled (100 nm) Silicon Mosfet Devices. In: Luryi, S., Xu, J., Zaslavsky, A. (eds) Future Trends in Microelectronics. NATO ASI Series, vol 323. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-1746-0_20
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DOI: https://doi.org/10.1007/978-94-009-1746-0_20
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