Abstract
Materials processing with lasers in a chemically reactive atmosphere (LCP) is a new and interdisciplinary field. The technique permits maskless single-step patterning of materials by deposition, surface modification, synthesis and etching [1,2]. The lateral dimensions of the processed regions range from several centimeters to less than one micrometer. Contrary to conventional techniques such as chemical vapor deposition (CVD), plasma deposition (PCVD) or plasma etching (PE), reactive ion sputtering (RIE) etc., LCP is not limited to planar substrates, but allows three dimensional fabrication as well.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Bäuerle D: Chemical Processing with Lasers. Springer Series in Materials Science 1. Berlin, Heidelberg: Springer, 1986.
a) Laude LD, Bäuerle D, Wautelet M(eds.): Interfaces under Laser Irradiation. Nato ASI Series. Dordrecht: M. Nijhoff, 1987.
b) Bäuerle D, Kompa KL, Laude LD(eds.): Laser Processing and Diagnostics II. Les Ulis: Les Editions de Physique, 1986.
c) Bäuerle D(ed.): Laser Processing and Diagnostics. Springer Series in Chemical Physics Berlin, Heidelberg: Springer, 1984.
d) Johnson AW, Ehrlich DJ, Schlossberg HR(eds.): Laser Controlled Chemical Processing of Surfaces. New York: North-Holland, 1984.
e) Osgood RM, Brueck SRJ, Schlossberg HR(eds.): Laser Diagnostics and Photochemical Processing for Semiconductor Devices. New York: North- Holland, 1983.
Szòrényi T, Piglmayer K, Zhang GQ, Bäuerle D: to be published
Zhang GQ, Szòrényi T, Bäuerle D: J. Appl. Phys., 1987
Zhang GQ, Piglmayer K, Szòrényi T, Bäuerle D: to be published
Otto J, Stumpe R, Bäuerle D: in Laser Processing and Diagnostics, Bäuerle D(ed.). Springer Series in Chemical Physics 39. Berlin, Heidelberg: Springer, 1984, p. 320
Kapenieks A, Eyett M, Bäuerle D: Appl. Phys. A 41, 331 (1986)
Kapenieks A, Stumpe R, Eyett M, Bäuerle D: in Proc. of the 6th IEEE Int. Symp. on Applications of Ferroelectrics, 1986, p. 696; Kapenieks A, Eyett M, Stumpe R, Bäuerle D: in Laser Processing and Diagnostics II, Bäuerle D, Kompa KL, Laude L(eds). Les Ulis: Physique, 1986, p. 165
Perl uzzo G, Destry J: Can J. Phys. J. 56, 453 (1978)
Sprogis A, Dimza V: phys. stat. sol. (a) 72, K57 (1982);.
Bäuerle D, Wagner D, Wòhlecke M, Dorner B, Kraxenberger H: Z. Physik B 38, 335 (1980)
Eyett M, Bäuerle D: to be published
Eyett M, Bäuerle D, Wersing W, Lubitz K, Thomann H: Appl. Phys. A 40, 235 (1986)
Eyett M, Bäuerle D, Wersing W, Thomann H: J. Appl. Phys. (1987)
Kullmer R, Bäuerle D: Appl. Phys. A 43 (1987)
Winters HF, Coburn JW, Chuang TJ: J. Vac. Sci. Technol. B1 (2), 469 (1983)
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1988 Martinus Nijhoff Publishers
About this chapter
Cite this chapter
Bauerle, D., Szorenyi, T., Zhang, G.Q., Piglmayer, K., Eyett, M., Kullmer, R. (1988). Laser-Induced Chemical Processing of Materials. In: Ehrlich, D.J., Nguyen, V.T. (eds) Emerging Technologies for In Situ Processing. NATO ASI Series, vol 139. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-1409-4_4
Download citation
DOI: https://doi.org/10.1007/978-94-009-1409-4_4
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-7130-7
Online ISBN: 978-94-009-1409-4
eBook Packages: Springer Book Archive