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The Use of Electron Microscopy for the Analysis of the Adhesive-Adherend Interface in the Aluminium-Aluminium Bonded Joint

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Abstract

Over the past 25–30 years much theoretical work has been carried out in an attempt to analyse the adhesive bond and hence determine the nature of the mechanisms of adhesion.

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References

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Author information

Authors and Affiliations

  1. Bonded Structures, Ciba-Geigy Plastics, CB2 4QD, Duxford, England

    J. A. Bishopp

  2. Cambridge Corrosion and Protection Centre, University of Manchester, Institute of Science and Technology, Manchester, M60 10D, England

    E. K. Sim, T. V. Smith, G. E. Thompson & G. C. Wood

Authors
  1. J. A. Bishopp
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  2. E. K. Sim
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  3. T. V. Smith
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  4. G. E. Thompson
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  5. G. C. Wood
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Editor information

Editors and Affiliations

  1. Adhesion Science Group, The City University, London, UK

    K. W. Allen

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© 1988 Elsevier Applied Science Publishers Ltd

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Bishopp, J.A., Sim, E.K., Smith, T.V., Thompson, G.E., Wood, G.C. (1988). The Use of Electron Microscopy for the Analysis of the Adhesive-Adherend Interface in the Aluminium-Aluminium Bonded Joint. In: Allen, K.W. (eds) Adhesion 12. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-1349-3_17

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  • DOI: https://doi.org/10.1007/978-94-009-1349-3_17

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-7100-0

  • Online ISBN: 978-94-009-1349-3

  • eBook Packages: Springer Book Archive

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