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Abstract

Moire interferometry is used to measure in-plane displacements, U and V, on flat surfaces. It extends the sensitivity of moire methods into the subwave-length range, making it suitable for the analysis of localized deformations of structural composites. The method is characterized by a remarkable set of qualities: it is a whole-field and real-time method, and it provides high sensitivity, excellent fringe contrast, high spatial resolution and extensive range. Moire interferometry nicely fills the gap between capabilities of other experimental techniques, inasmuch as it can be used in zones of very high strain gradients and it can be used to determine shear strains as readily as normal strains.

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  1. Czarnek, R., Post, D., and Guo, Y., “Strain Concentration Factors in Composite Tensile Members with Central Holes,” Proc. 1987 SEM Spring Conf. on Experimental Mechanics, Houston, TX (June 14–19, 1987).

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  2. Post, D., Czarnek, R., Joh, D., Jo, J. and Guo, Y, “Deformation of a Metal-Matrix Tensile Coupon with a Central Slot: An Experimental Study,” Journal of Composites Technology & Research, Vol. 9, No. 1, Spring 1987, pp. 3–9.

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  3. Post, D., “Moire Interferometry,” Handbook of Experimental Mechanics, ed. A.S. Kobayashi, Ch. 7, Prentice-Hall, Englewood Cliffs, NJ (1987).

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  4. Post, D., Dai, F.L., Guo, Y. and Ifju, P., “Interlaminar Shear Moduli of Cross-Ply Laminates: An Experimental Analysis,” J. Composite Materials, 23 (3), pp. 264–279 (March 1989).

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  5. Guo, Y., Post, D. and Czarnek, R., “The Magic of Carrier Fringes in Moire Interferometry,” experimental mechanics (to be published).

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© 1989 Society for Experimental Mechanics

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Post, D. (1989). Moire Interferometry for Composites. In: Pendleton, R.L., Tuttle, M.E. (eds) Manual on Experimental Methods for Mechanical Testing of Composites. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-1129-1_12

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  • DOI: https://doi.org/10.1007/978-94-009-1129-1_12

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-7000-3

  • Online ISBN: 978-94-009-1129-1

  • eBook Packages: Springer Book Archive

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