Abstract
Atomic diffusion processes in semiconductors play an important role in the fabrication of electronic devices in various areas. These areas include:
-
(i)
diffusion of electrically active dopants for the formation of n- or p-doped regions in the semiconductor material as schematically indicated in Fig. 1 for the case of ion-implanted dopants as a source for a subsequent diffusion step at elevated temperatures,
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(ii)
diffusion of electrically active contaminants which decrease the minority carrier lifetime and should therefore be avoided or induced to diffuse and precipitate at appropriate gettering sites,
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(iii)
diffusion of elements used for defect engineering such as oxygen or carbon in silicon for intrinsic gettering purposes or of hydrogen for passivating undesirable electrically active defects, and
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(iv)
diffusion of intrinsic point defects such as vacancies and self-interstitials which determine self-diffusion as well as other phenomena related to material transport processes, as, e.g., the growth or shrinkage of dislocation loops, which may be induced by certain processing steps.
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Gösele, U. (1989). Diffusion in Semiconductors. In: Levy, R.A. (eds) Microelectronic Materials and Processes. NATO ASI Series, vol 164. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-0917-5_12
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