Abstract
Ion Implantation has emerged as a common technique of doping semiconductors for integrated circuit production [1–4]. Ion implantation represents the introduction of energetic charged particles into targets with enough energy to penetrate beyond the surface region. The advantages of ion implantation include:
-
(i)
precise on-line control of the total number of implanted ions,
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(ii)
independent control of the penetration depth from dose,
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(iii)
achievement of a wide concentration range, with the upper limit generally set by sputtering yield rather than by equilibrium solubility,
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(iv)
ease of integration within a silicon planar technology. The oxide layers used for masking against diffusion can also be used to mask against the ion beam,
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(v)
intrinsic low temperature processing, although a subsequent annealing is generally necessary.
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References
Ion Implantation Techniques H. Ryssel and H. Glawischnig, Eds., Springer-Verlag, Berlin (1982).
Ion Implantation and Beam Processing, J. S. Williams and J. M. Poate, Eds. Academic Press, New York (1984).
Ion Implantation: Science and Technology, J. F. Ziegler, Eds., Academic Press, Orlando, Florida (1984).
H. Ryssel and I. Ruge, Ion Implantation, John Wiley & Sons, New York (1986).
K. A. Pickar Applied Solid State Science, Vol. 5, R. Wolfe, Ed., Academic Press, New York (1975), p. 151.
K. J. Reeson, Nucl. Instrum. & Methods Phys. Res., B19/20, 269 (1987).
H. W. Lam and R. F. Pinizzotto, J. Cryst. Growth, 63, 554 (1983).
G. K. Celler, P. L. F. Hemment, K. W. West, and J. M. Gibson, Appl. Phys. Lett., 48, 532 (1986).
J. F. Gibbons, Proc. IEEE, 60, 1062 (1972).
G. K. Celler, and T. E. Seidel Applied Solid State Science, Part C, D. Kahng, Ed., Academic Press, New York (1985), p. 2.
Laser Annealing of Semiconductors, J. M. Poate and J. W. Mayer, Eds., Academic Press, New York (1982).
Surface Modification and Alloying, J. M. Poate, G. Foti and D. C. Jacobson, Eds., Plenum, New York (1983).
Laser and Electron-Beam Solid Interaction and Materials Processing, Vol. 1, G. J. Gibbons, L. D. Hess, and T. W. Sigmon, Eds., North Holland, New York (1981).
C. Hill, Nucl. Instrum. & Methods Phys. Res., B19/20, 348 (1987).
T. Tokuyama, Nucl. Instrum. & Methods Phys. Res., B19/20, 299 (1987).
M. I. Current and W. A. Keenan, Solid State Technol., 28 (2), 139 (1985).
H. Glawischnig, Ion Implantation Techniques, H. Ryssel and H. Glawischnig, Eds., Springer-Verlag, Berlin (1982), p. 3.
D. Aitken, Ion Implantation Techniques, H. Ryssel and H. Glawischnig, Eds., Springer-Verlag, Berlin (1982), p. 23.
J. H. Freeman, Nucl. Instrum. & Methods, 22, 306 (1963).
C. M. McKenna, Ion Implantation Techniques, H. Ryssel and H. Glawischnig, Eds., Springer-Verlag, Berlin (1982), p. 73.
G. Ryding and M. Farley, Nucl. Instrum. & Methods, 189, 295 (1981).
H. E. Schiott, Mat.-Fys. Medd. Dan. Vidensk. Selsk., 35 (9), 1 (1966).
J. Lindhard, M. Scharff and H. E. Schiott, Mat.-Fys. Medd. Dan. Vidensk. Selsk., 33 (14), 1 (1963).
K. B. Winterbon, Ion Implantation Range and Energy Deposition Distributions, Vol. 2, Plenum, New York (1975).
J. Lindhard and A. Winter, Mat.-Fys. Medd. Dan. Vidensk. Selsk., 34 (4), 1 (1964).
J. A. Davies, Surface Modification and Alloying, J. M. Poate, G. Foti and D. C. Jacobson Eds., Plenum, New York (1983), p. 189.
K. B. Winterbon, P. Sigmund, and J. B. Sanders Mat.-Fys. Medd. Dan. Vidensk. Selsk., 37 (14), 1 (1970).
S. Kalbitzer and H. Oetzmann, Proc. of the 1978 Int. Conf. on Ion Beam Modification of Materials, Hungarian Academy of Sciences, Budapest (1979), p. 3.
D. K. Brice, Ion Implantation Range and Energy Deposition Distributions, Vol. 1, Plenum, New York (1975).
J. P. Biersack and L. G. Haggmark, Nucl. Instrum. & Methods, 174, 257 (1980).
D. H. Lee and J. W. Mayer, Proc. IEEE, 62, 1241 (1974).
W. K. Hofker, Philips Res. Rep. Suppl., 8, (1975).
J. F. Gibbons, Handbook on Semiconductors, Vol. 3, T. S. Moss, Ed., North-Holland, Amsterdam (1980), Chapt. 10.
K. Tsukamoto, Y. Akasaka, and K. Kijima, Jpn. J. Appl. Phys., 19, 87 (1980).
K. Cho, W. R. Allen, T. G. Finstad, W. K. Chu, J. Liu, and J. J. Wortman, Nucl. Instrum. & Methods Phys. Res., B7/8, 265 (1985).
T. E. Seidel, VLSI Technology, S. M. Sze, Ed., McGraw-Hill, New York (1983), p. 219.
H. Ishiwara, S. Furukawa, J. Yamada, and M. Kawamura, Ion Implantation in Semiconductors, S. Namba, Ed., Plenum, New York (1975), p. 423.
T. Hirao, K. Lone, and S. Takayanagi, J. Appl. Phys., 50, 193 (1979).
E. F. Kennedy, C. Csepregi, J. W. Mayer and T. W. Sigmon, Ion Implantation in Semiconductors and Other Materials, F. Chernow, Ed., Plenum, New York (1977), p. 511.
J. Sansbury, Ion Implantation and Its Contribution to Device and Integrated Circuit Technology, Varian Seminar, VR-99–1975-Vacuum Division, Palo Alto, California (1978).
J. Bottiger, J. A. Davies, P. Sigmund, and K. B. Winterbon, Radiat Eff., 11, 69 (1971);
J. Bottiger, H. Wolder Jorgensen, and K. B. Winterbon, Radiat Eff., 11, 133 (1971).
P. Sigmund, Phys. Rev., 184, 383 (1969).
H. H. Andersen and H. L. Bay, J. Appl. Phys., 46, 1919 (1975).
H. Ryssel and K. Hoffman, Process and Device Simulation for MOS-VLSI Circuits, P. Antognetti, D. Antoniadis, R. Dutton, and W. Oldham, Eds., NATO ASI Series, Martinus Nijhoff, The Hague, Netherlands (1983), p. 125.
S. Furukawa, H. Matsumura, and H. Ishiwara, Jpn. J. Appl. Phys., 11, 134 (1972).
H. Matsumura and S. Furukawa, Jpn. J. Appl. Phys., 14, 1783 (1975).
J. Lindhard, Mat.-Fys. Medd. Dan. Vidensk. Selsk., 34 (14), 1 (1965).
J. A. Davies, Material Characterization Using Ion Beams, J. P. Thomas, Ed., Plenum, New York (1979), p. 343.
R. G. Wilson, H. L. Dunlap, D. M. Jamba and M. R. Myers, Angular Sensitivity of Controlled Implanted Doping Profiles, NBS Spec. Publ. No. 400–49 National Bureau of Standards, Gaithersburg, Maryland.
N. L. Turner, M. I. Current, T. C. Smith, and D. Crane, Solid State Technol., 28 (2), 163 (1985).
M. I. Current, R. A. Martin, K. Doganis, and R. H. Bruce, Semicond. Int., 8 (6), 106 (1985).
D. Pramanik and M. I. Current, Solid State TechnoL, 27 (5), 211 (1984).
C. M. McKenna, C. Russo, B. Pedersen, D. Downey, and R. Liebert, Semicond. Int., 9 (4), 101 (1986).
R. D. Rathmell and M. L. Sundquist, Nucl. Instrum. & Method Phys. Res., B6, 56 (1985).
D. A. Thompson and R. S. Walker, Radiat Eff., 36, 91 (1978).
F. F. Morehead Jr. and B. L. Crowder, Radiat. Eff., 6, 27 (1970).
F. Spaepen and D. Turnbull, Laser-Solid Interactions and Laser Processing, Am. Inst. Phys. Conf. Series, No. 50, American Institute of Physics, New York (1979), p. 73.
L. A. Christel, J. F. Gibbons, and S. Mylroie, J. Appl. Phys., 51, 6176 (1980).
B. K. Brice, J. Appl. Phys., 46, 3385 (1975).
P. V. Pavlov, D. I. Tel’baum, E. I. Zorin, V. I. Alekseev, Sov. Phys.-Solid State, 8, 2141 (1967).
R. S. Walker and D. A. Thompson, Radiat. Eff. 37, 113 (1978).
G. H. Kinchin and R. S. Pease, Rep. Progr. Phys., 18, 1 (1985).
P. Sigmund, Appl. Phys. Lett, 25, 169 (1974).
T. E. Seidel and A. U. MacRae — First International Conference on Ion Implantation, F. H. Eisen and C. S. Chadderton, Eds., Gordon and Breach, London (1971), p. 169.
A. Chu and J. F. Gibbons, Ion Implantation, F. Chernow, Ed., Plenum, New York (1976), p. 711.
L. Csepregi, E. F. Kennedy, J. W. Mayer, and T. W. Sigmon, J. Appl. Phys., 49, 3096 (1978).
L. Csepregi, J. W. Mayer, and T. W. Sigmon, Appl. Phys. Lett., 29, 92 (1976).
G. Foti, L. Csepregi, E. F. Kennedy, J. W. Mayer, P. P. Pronko, and M. D. Reichtin, Philos. Mag., A37, 591 (1978).
L. Csepregi, E. F. Kennedy, T. J. Gallagher, J. W. Mayer, and T. W. Sigmon, J. Appl. Phys., 48, 4234 (1977).
E. F. Kennedy, L. Csepregi, J. W. Mayer, and T. W. Sigmon, J. Appl. Phys., 48, 4241 (1977).
S. S. Lau, W. F. Tseng, and J. W. Mayer, Handbook on Semiconductors, Vol. 3, S. P. Keller, Ed., North-Holland, Amsterdam (1980), Chapt. 7.
I. S. Suni, G. Goltz, M. G. Grimaldi, M.-A. Nicolet, and S. S. Lau, Appl. Phys. Lett. 40, 269 (1982).
J. S. Williams and R. G. Elliman, Appl. Phys. Lett., 37, 829 (1980).
S. U. Campisano and A. E. Barbarino, Appl. Phys., 25, 153 (1981).
J. S. Williams, Surface Modification and Alloying, J. M. Poate, G. Foti, and D. C. Jacobson, Eds., Plenum, New York (1983), p. 133.
J. S. Williams and R. G. Elliman, Phys. Rev. Lett., 51, 1069 (1983).
H. Tamura, T. Ikeda, and T. Tokuyama, Second International Conference on Ion Implantation, I. Ruge and J. Graul, Eds., Springer-Verlag, Berlin, (1972), p. 96.
S. Mader, Ion Implantation: Science and Technology, J. F. Ziegler, Ed., Academic Press, Orlando, Florida (1984), p. 109.
K. Tsukamoto, Y. Akasaka, and K. Kijima, Jpn. J. Appl. Phys., 19, 87 (1980).
H. Müller, J. Gyulai, J. W. Mayer, W. K. Chu, and T. W. Sigmon, J. Electrochem. Soc., 122, 1234 (1975).
E. Rimini, Surface Modification and Alloying, J. M. Poate, G. Foti, and D. C. Jacobson, Eds., Plenum, New York (1983), p. 15.
G. Foti and E. Rimini Laser Annealing of Semiconductors, J. W. Mayer and J. M. Poate, Eds. Academic Press, New York (1982), p. 203.
J. F. Gibbons and T. W. Sigmon, Laser Annealing of Semiconductors, J. M. Poate and J. W. Mayer, Eds., Academic Press, New York (1982), p. 325.
T. E. Seidel, C. S. Pai, D. J. Lischner, and S. S. Lau, Extended Abst. Electrochem. Soc., 84–7, 184 (1984).
T. E. Seidel, D. J. Lischner, C. S. Pai, R. V. Knoell, D. H. Maker, and D. C. Jacobson, Nucl Instrum. & Methods Phys. Rev., B7/8, 251 (1985).
D. J. Lischner and G. K. Celler, Laser and Electron — Beam Interactions with Solids, B. R. Appleton and G. K. Celler, Eds. North-Holland, Amsterdam (1982), p. 759.
S. R. Wilson, W. H. Paulson, R. B. Gregory, A. H. Hamdi, and F. D. McDaniel, J. Appl Phys., 55, 12 (1984).
S. R. Wilson, R. B. Gregory, and W. H. Paulson, Mater. Res. Soc. Symp. Proc, Vol. 52, Materials Research Society, Pittsburgh, Pennsylvania (1986), p. 181.
R. E. Sheet, Mater. Res. Soc. Symp. Proc., Vol. 52, Materials Research Society, Pittsburgh, Pennsylvania (1986), p. 191.
A. Gat, IEEE Electron Device Lett., 2, 85 (1981).
J. Gelpay and P. Stump, Microelectronic Manufacturing and Testing, Lake Publishing, Libertyville, Illinois (1983), p. 21.
R. T. Fulks, C. J. Russo, P. R. Hanley, and T. I. Karmins, Appl. Phys. Lett., 39, 604 (1981).
Operational Manual for 210M, AG Associated, Palo Alto, California (1982).
M. Y. Tsai and B. G. Streetman, J. Appl. Phys., 50, 183 (1979).
V. K. Basre and D. F. Downey, Sixth International Conference on Ion Implantation, Berkeley, California (1986).
N. E. B. Cowern, K. J. Yallup, and D. J. Godfrey, Appl. Phys. Lett., 48, 704 (1986).
S. Solmi, S. Guimaraes, E. Landi, and P. Negrini, Semiconductor Silicon 1986, H. R. Huff, T. Abe, and B. Kolbeson, Eds., The Electrochemical Society, Pennington, New Jersey (1986), p. 583.
D. E. Davies, IEEE Electron Device Lett., 6, 397 (1985).
D. G. Beanland, Ion Implantation and Beam Processing, J. S. Williams and J. M. Poate, Eds., Academic Press, New York (1984), p. 261.
J. Narayan and O. W. Holland, J. Electrochem. Soc., 131, 2651 (1984).
S. Cannavò, M. G. Grimaldi, E. Rimini, G. Ferla, and L. Gandolfi, Appl. Phys. Lett., 47, 138 (1985).
J. S. Williams, R. G. Elliman, W. L. Brown, and T. E. Seidel, Mater. Res. Soc Symp. Proc., Vol. 37, Materials Research Society, Pittsburgh, Pennsylvania, (1985), p. 127.
J. S. Williams, R. G. Elliman, W. L. Brown, and T. E. Seidel, Phys. Rev. Lett., 55, 1482 (1985).
A. Leiberich, D. M. Maher, R. V. Knoell and W. L. Brown, Nucl. Instrum. & Methods Phys. Res., B19/20, 457 (1987).
S. Cannavò, A. La Ferla, E. Rimini, G. Ferla, and L. Gandolfi, J. Appl. Phys., 59, 4038 (1986).
S. Cannavò, A. La Ferla, S. U. Campisano, E. Rimini, G. Ferla, L. Gandolfi, J. Liu, and M. Servidori, Mat. Res. Soc. Symp. Proc., Vol. 51, Materials Research Society, Pittsburgh, Pennsylvania (1986), p. 328.
D. L. Kwong, D. C. Meyers, N. S. Alvi, IEEE Electron Device Lett., 6, 244 (1985).
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Rimini, E. (1989). Ion Implantation. In: Levy, R.A. (eds) Microelectronic Materials and Processes. NATO ASI Series, vol 164. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-0917-5_11
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