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Solving a Model Interface Problem for the Laplace Operator by Boundary Collocation and Applications

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Proceedings of the Third European Conference on Mathematics in Industry

Part of the book series: European Consortium for Mathematics in Industry ((ECMI,volume 5))

Abstract

Boundary collocation is a method for computing solutions to boundary problems for linear partial differential equations, for which complete families of particular solutions are explicitly known. The method is simple to implement on a computer and has been found to be competitive for many problems of electrical engineering.

An application of boundary collocation requires several choices, such as the choices of subspace and basis of particular solutions, and the choice of collocation points. The numerical aspects of these choices have so far only received little attention. This paper investigates how subspace, basis and collocation points should be chosen when solving a model interface problem. The purpose of this investigation is to obtain guidelines for these choices applicable also to other boundary problems. These guidelines have been used to solve two problems that arose in Swedish industry: an investigation of microwave heating of food with the aim of designing equipment to achieve uniform heating, and a study of the heat conduction of a rock important for the design of a hot water storage near Uppsala for water heated by solar collectors.

Research supported in part by NSF under Grant DMS-8704196.

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© 1990 B. G. Teubner Stuttgart and Kluwer Academic Publishers

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Reichel, L. (1990). Solving a Model Interface Problem for the Laplace Operator by Boundary Collocation and Applications. In: Manley, J., McKee, S., Owens, D. (eds) Proceedings of the Third European Conference on Mathematics in Industry. European Consortium for Mathematics in Industry, vol 5. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-0629-7_11

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  • DOI: https://doi.org/10.1007/978-94-009-0629-7_11

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-6770-6

  • Online ISBN: 978-94-009-0629-7

  • eBook Packages: Springer Book Archive

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