Abstract
A complete model for PACVD reactors involving detailed calculations of the reaction rate constants, and the diffusion coefficients of the neutral and free radical species, based on the ambipolar approximation for glow discharges, is applied to the deposition of silicon nitride from silane and ammonia, the model results are compared with experimental data obtained by an Advanced Semiconductor Materials reactor named Plasma Enhanced CVD III.
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© 1990 Kluwer Academic Publishers
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Masi, M., Morbidelli, M., Carrà, S. (1990). Kinetic Aspect of PACVD Modeling. In: Garbassi, F., Occhiello, E. (eds) High Energy Density Technologies in Materials Science. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-0499-6_10
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DOI: https://doi.org/10.1007/978-94-009-0499-6_10
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6710-2
Online ISBN: 978-94-009-0499-6
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