Abstract
Silicon dioxide plays essential roles in silicon planar processing. It serves as the most common insulator and dielectric in the technology; it serves to mask silicon against the indiffusion of dopants; and it provides two types of passivation, first as a tough glassy covering that affords mechanical protection to completed dice, and second, as a means of saturating the dangling bonds at the surface of the wafer. By this process the wafer surface becomes well behaved, making for better devices.
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© 1990 Van Nostrand Reinhold
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Anner, G.E. (1990). Oxidation. In: Planar Processing Primer. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-0441-5_5
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