Abstract
This presentation is adapted from a report prepared for the National Security Industrial Association (NSIA) by a Task Force formed to assess the potential impact of changes in electronics packaging/interconnect on military systems. The findings and recommendations should be of interest to all the electronics community because the current modes of doing business in military electronics are expensive and opportunities for dual-use technology applications could extend beyond the traditional military electronics industry. Some of the comments in this presentation are the author’s opinion only and may not represent the consensus position of either the Task Force or Allied-Signal.
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References
“The VHSIC Program: Its Impact on the Commercial IC Industry”, The Information Network (1988).
“Microelectronics to the Year 2000”, SRI International, Business Intelligence Program, Report No.739.
“The World of Silicon: It’s Dog Eat Dog”, IEEE Spectrum, Sept 1988.
Ford Motor Company estimates and the University of Michigan Delphi III market research study.
Ralph Anavy “Strategy 2000”, Electronic Outlook Corporation, 1990.
“Swords Into Plowshares”, Forbes, July 23 1990.
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© 1991 Van Nostrand Reinhold
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Blazej, D.C. (1991). Microelectronics Packaging/Interconnect: An Industry in Transition. In: Morris, J.E. (eds) Electronics Packaging Forum. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-0439-2_14
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DOI: https://doi.org/10.1007/978-94-009-0439-2_14
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6681-5
Online ISBN: 978-94-009-0439-2
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