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An Introduction to Tape Automated Bonding Technology

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Electronics Packaging Forum

Abstract

Figure 1.1 shows a Tape Automated Bonding (TAB) assembly with 544 I/Os at 0.008″ (0.203 mm) outer-lead spacing (courtesy of Hewlett-Packard Electronics Packaging Laboratory). It consists of three major parts, the silicon chip, the copper beam leads, and the epoxy/glass FR-4 printed circuit board. In this chapter, an introduction to TAB for fine pitch, high I/O, high performance, high yield, high volume, and high reliability is presented. Emphasis is placed upon a new understanding of the key elements (e.g., tapes, bumps, inner lead bonding, testing and burn-in on tape-with-chip, encapsulation, outer lead bonding, thermal management, reliability, etc.) of this rapidly moving technology.

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Authors
  1. John H. Lau
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  2. Steve J. Erasmus
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  3. Donald W. Rice
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  1. State University of New York, Binghamton, USA

    James E. Morris

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© 1991 Van Nostrand Reinhold

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Lau, J.H., Erasmus, S.J., Rice, D.W. (1991). An Introduction to Tape Automated Bonding Technology. In: Morris, J.E. (eds) Electronics Packaging Forum. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-0439-2_1

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  • DOI: https://doi.org/10.1007/978-94-009-0439-2_1

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