Abstract
The novel thin film materials manufactured for MEMS sensors, actuators, and multifunctional coatings demand the development of novel methodologies for the characterization of their anisotropic mechanical properties, which dominate as submicron sized devices become technologically feasible. While the limitations of continuum mechanics are experimentally still unexplored, material anisotropy and scale-dependence of deformations require a combined experimental, analytical, and numerical approach with the development of novel instrumentation being at the forefront of this effort. The local character of many phenomena at the nanoscale imposes the challenge to employ methodologies that can specifically and directly address the scale limitations and requirements. This limits our current inventory to techniques and methodologies that provide resolution beyond the optical diffraction limit and include either probe or electron microscopes. The high resolution imaging capabilities of these tools provide the basis for new developments but their ability to furnish quantitative information remains largely unexplored. While such instruments may replace macroscopic cameras employed to conduct full- field measurements, the large-scale test apparatuses need to be also adapted to the new scale demands. These direct approaches and their potential to succeed in the nanoscale mechanics arena are discussed in this chapter. The methodologies of global (average) property measurements and local, nanometer-level, measurements of local constitutive properties are discussed with reference to typical MEMS materials. Special emphasis is given to the full-field methodology with an update to the most recent developments. Finally, the scale-related failure properties of brittle MEMS materials and their implication to thin film material and device design and implementation are discussed.
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References
I. Chasiotis, W.G. Knauss, The Influence of Fabrication Governed Surface Conditions on the Mechanical Strength of Thin Film Materials, Proceedings of the Materials Research Society 657, pp. EE2.2.1–EE2.2.6, 2001.
I. Chasiotis, W.G. Knauss, The Mechanical Strength of Polysilicon Films: 1. The Influence of Fabrication Governed Surface Conditions, Journal of the Mechanics and Physics of Solids 51 (8), pp. 1533–1550, 2003.
S.M. Allameh, B. Gally, S. Brown, W.O. Soboyejo, Surface Topology and Fatigue in Si MEMS Structures, Mechanical Properties of Structural Films, STP 1413, C. Muhlstein and S. Brown, Eds., American Society for Testing and Materials, West Conshohocken, PA, June 2001.
D.T. Read, J.W. Dally, New method for measuring the strength and ductility of thin films, Journal of Materials Research, 1993, 8 (7), 1542–1549.
[5] W.N. Sharpe Jr., B. Yuan, R.L. Edwards, A new technique for measuring the mechanical properties of thin films, Journal of Microelectromechanical Systems, 6 (3), pp. 193–199, 1997.
J.C. Fox, R.L. Edwards, W.N. Sharpe Jr., Thin film gage markers for laser-based strain measurement on MEMS materials, Experimental Techniques, pp. 28–30, 1998.
W.N. Sharpe, K.R. Vaidyanathan, B. Yuan, R.L. Edwards, New technique for measuring Poisson's ratio of MEMS materials, Materials for Mechanical and Optical Microsystems, Materials Research Society Symposium Proceedings 444, Materials Research Society, Pittsburgh, PA, USA, pp. 185–190, 1997.
[8] W.N. Sharpe Jr., K.M. Jackson, K.J. Hemker and Z. Xie, Effect of specimen size on Young’s modulus and fracture strength of polysilicon, Journal of Microelectromechanical Systems 10 (3), pp. 317–326, 2001.
T. Tsuchiya, O. Tabata, J. Sakata and Y. Taga, Tensile testing of polycrystalline silicon thin films using electrostatic force grip, Transactions of IEEE of Japan 116-E (10), pp. 441–446, 1996.
M.A. Haque, M.T.A. Saif, Mechanical behavior of 30-50 nm thick aluminum films under uniaxial tension, Scripta Materialia 47 (12), pp. 863–867, 2002.
I. Chasiotis, W.G. Knauss, Investigation of Thin Film Mechanical Properties by Probe Microscopy, Proceedings of International Society for Optical Eng. (SPIE) 3512, pp. 66–75, Santa Clara, CA, 1998.
I. Chasiotis, W.G. Knauss, A new microtensile tester for the study of MEMS materials with the aid of atomic force microscopy, Experimental Mechanics 42 (1), pp. 51–57, 2002.
M.A. Sutton, W.J. Wolters, W.H. Peters, W.F. Ranson, S.R. McNeil, Determination of Displacements using an Improved Digital Image Correlation Method, Image Vision Computing, 1 (3), pp. 133–139, 1983.
G. Vendroux, W.G. Knauss, Submicron Deformation Field Measurements II: Improved Digital Image Correlation, Experimental Mechanics, 38 (2), pp. 86–92, 1998.
H. Lu, P.D. Cary, Deformation measurements by digital image correlation: Implementation of a second-order displacement gradient, Experimental Mechanics 40 (4), pp. 393–400, 2000.
I. Chasiotis, W.G. Knauss, Experimentation at the Micron and Submicron Scale, Encyclopedia of Comprehensive Structural Integrity Vol. 8. Interfacial and Nanoscale Failure. Volume Editors: W. Gerberich and W. Yang, Elsevier Science, pp. 41–87, 2003.
I. Chasiotis, W.G. Knauss, The Mechanical Strength of Polysilicon Films: 2. Size Effects Associated with Elliptical and Circular Perforations, Journal of the Mechanics and Physics of Solids 51 (8), pp. 1551–1572, 2003.
W.G. Knauss, I. Chasiotis, Y. Huang, Mechanical Measurements at the Micron and Nanometer Scales, Mechanics of Materials 35 (3-6), pp. 217–231, 2003.
W.N. Reynolds, Physical Properties of Graphite, Amsterdam, Elsevier Pub. Co., 1968.
I. Chasiotis, S. Cho, T.A. Friedman, J. Sullivan, Mechanical Properties of Tetrahedral Amorphous Diamond-like Carbon (ta-C) MEMS, Proceedings of the Annual Conference of the Society for Experimental Mechanics, pp. 170–175, 2003.
I. Chasiotis, W.G. Knauss, Size Effects Determined From Tensile Tests of Perforated MEMS Scale Specimens, Proceedings of the Materials Research Society 687, pp. B2.4.1- B2.4.6, 2002.
J.F. C¨¢rdenas-Garc¨ªa, S. Cho, I. Chasiotis, Determination of Elastic Properties from Non-linear MEMS Geometries, Proceedings of the Annual Conference of the Society for Experimental Mechanics, 2003.
Y.M. Xing, W. Yang, Measuring crack tip deformation with nanoscopic resolution, 10th International Conference on Fracture, Hawaii, USA, 2001.
P. Shrotriya, S. Allameh, A. Butterwick, S. Brown, W.O Soboyejo, Mechanisms of fatigue in polysilicon MEMS structures, Materials Research Society Symposium Proceedings 687, pp 29–34, 2002.
O. Tabata, K. Kawahata, S. Sugiyama, I. Igarashi, Mechanical property measurements of thin films using load-deflection of composite rectangular membranes, Sensors and Actuators A 20, 135–141, 1989.
J.J. Vlassak, W.D. Nix, A new bulge test technique for the determination of Young’s modulus and Poisson’s ratio of thin films, Journal of Materials Research 7 (12), pp. 3242–3249, 1992.
D. Maier-Schneider, J. Maibach, E. Obermeier, D. Schneider, Variations in Young's modulus, intrinsic stress of LPCVD polysilicon due to high-temperature annealing, Journal of Micromechanics and Microengineering 5, pp. 121–124, 1995.
D. Maier-Schneider, J. Maibach, E. Obermeier, A new analytical solution for the load- deflection of square membranes, Journal of Microelectromechanical Systems 4 (4), pp. 238–241, 1995.
S.P. Timoshenko, Theory of Plates and Shells, 2nd Edition, McGraw Hill, pp. 124, 210, 1959.
S. Jayaraman, R.L. Edwards, K.J. Hemker, Relating mechanical testing and microstructural features of polysilicon thin films, Journal of Materials Research 14 (3), pp. 688–697, 1999.
C.T. Loy, S.C. Pradhan, T.Y. Ng, K.Y. Lam, A series solution approach to an analytical load-deflection relation for the measurement of mechanical properties of thin films, Journal of Micromechanics and Microengineering, 9 (4), pp. 341–344, 1999.
J.Y. Pan, P. Lin, F. Maseeh, S.D. Senturia, Verification of FEM analysis of load- deflection methods for measuring mechanical properties of thin films, Technical Digest IEEE Solid State Sensors and Actuators Workshop, Hilton Head Island, SC, pp.70–73, 1990.
M.K. Small, W.D. Nix, Analysis of the accuracy of the bulge test in determining the mechanical properties of thin films, Journal of Materials Research 7 (6), pp. 1553–1563, 1992.
G.L. Pearson, W.T. Read, W.L. Feldman, Deformation and fracture of small silicon crystals, Acta Metallurgica 5, pp. 181–191, 1957.
S. Johansson, J. Schweitz, L. Tenerz, J. Tiren, Fracture testing of silicon microelements in situ in a scanning electron microscope, Journal of Applied Physics 63 (10), pp. 4799–4803, 1988.
M. Biebl, T. Scheiter, C. Hierold, H. Philipsborn, H. Klose, Micromechanics compatible with an 0.8 µm CMOS process, Sensors and Actuators A, 46-47, pp. 593–597, 1995.
B.D. Jensen, M.P. de Boer, N.D. Masters, F. Bitsie, D.A. LaVan, Interferometry of actuated microcantilevers to determine material properties and test structure nonidealities in MEMS, Journal of Microelectromechanical Systems 10 (3), pp. 336–346, 2001.
J. Menc¨ªk and E. Quandt, Determination of elastic modulus of thin films and small specimens using beam bending methods, Journal of Materials Research 14 (5), pp. 2152–2161, 1999.
C. Serre, J.R. Morante, P. Gorostiza, F. Sanz, A. P¨¦rez-Rodr¨ªguez, Measurement of micromechanical properties of polysilicon microstructures with an atomic force microscope, Sensors and Actuators A: Physical 67 (1-3), pp. 215–219, 1998.
S.P. Timoshenko, J.N. Goodier, Theory of Elasticity, 3 Edition, McGraw Hill, pp. 46, 1970.
S.P. Timoshenko, Strength of Materials, Part I, 2n edition, D. Van Nostrand Co., New York, pp. 299, 1940.
W.J. O’Donnell, The additional deflection of a cantilever due to the elasticity of the support, Journal of Applied mechanics, 27 (3), pp. 461–464, 1960.
N.A. Burnham, X. Chen, C.S. Hodges, G.A. Matei, E.J. Thoreson, C.J. Roberts, M.C. Davies, S.J.B. Tendle, Comparison of calibration methods for atomic-force microscopy cantilevers, Nanotechnology 14 (1), pp. 1–6, 2003.
B.D. Jensen, F. Bitsie, M. de Boer, Interferometric measurement for improved understanding of boundary effects in micromachined beams, Proceedings of SPIE ¨C the International Society for Optical Engineering 3875, pp. 61–72, 1999.
J.M. Bustillo, R.T. Howe, R.S. Muller, Surface micromachining for microelectromechanical systems, Proceedings of the IEEE 86 (8), pp. 1552–1574, 1998.
W.W. Van Arsdell, S.B. Brown, Subcritical crack growth in silicon MEMS, Journal of Microelectromechanical Systems 8 (3), pp. 319–327, 1999.
CL. Muhlstein, S.B. Brown, R.O. Ritchie, High-cycle fatigue and durability of polycrystalline silicon thin films in ambient air, Sensors and Actuators A: Physical 94 (3), pp. 177–188, 2001.
R. Ballarini, R. L. Mullen, A.H. Heuer, The effects of heterogeneity and anisotropy on the size effect in cracked polycrystalline films, International Journal of Fracture 95, pp. 19–39, 1999.
X.D. Li, B. Bhushan, A review of nanoindentation continuous stiffness measurement technique and its applications, Materials Characterization 48 (1), pp. 11–36, 2002.
X.D. Li, B. Bhushan, Fatigue studies of nanoscale structures for MEMS/NEMS applications using nanoindentation techniques, Surface Coating Technology 163, pp. 521–526, 2003.
M.T.A. Saif, N.C. MacDonald, Measurements of forces and spring constants of microinstruments, Review of Scientific Instruments 69 (3), pp. 1410–1422, 1998.
E. Arzt, Size effects in materials due to microstructural and dimensional constraints: a comparative review, Acta Materialia 46 (16), pp. 5611 –5626, 1998.
W.N. Sharpe Jr., J.S. Brown, G.C. Johnson, W.G. Knauss, Round-robin tests of modulus and strength of polysilicon, Materials Research Society Symposium Proceedings 518, pp. 57 –65, 1998.
A.J. Hallinan, A review of the Weibull distribution, Journal of Quality Technology 25 (2), pp. 85–93, 1993.
A.A. Griffith, The theory of rupture, Proceedings of the First International Congress for Applied Mechanics, Delft, pp. 55 –63, 1924.
A.A. Griffith, The phenomena of rupture and flow in solids, Philosophical Transactions of the Royal Society A 221, pp. 163 –198, 1921.
S. Greek, F. Ericson, S. Johansson, J. Schweitz, In situ tensile strength measurement and Weibull analysis of thick film and thin film micromachined polysilicon structures, Thin Solid Films 292, pp. 247 –254, 1997.
T. Tsuchiya, O. Tabata, J. Sakata, Y. Taga, Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin films, Journal of Microelectromechanical Systems 7 (1), pp. 106 –113, 1998.
D.A. LaVan, T. Tsuchiya, G. Coles, W.G. Knauss, I. Chasiotis, D. Read, Cross comparison of direct strength testing techniques on polysilicon films, mechanical properties of structural films, ASTM STP 1413, C. Muhlstein and S. B. Brown, Editors, American Society for Testing and Materials, West Conshohocken, PA. 2001.
J.N. Ding, Y.G, Meng, S.Z. Wen, Specimen size effect on mechanical properties of polysilicon microcantilever beams measured by deflection using a nanoindenter, Materials Science and Engineering B 83, pp. 42¨C47, 2001.
T. Namazu, Y. Isono, T. Tanaka, Nano-scale bending test of Si beams for MEMS, in Proceedings IEEE Thirteenth Annual International Conference on MicroElectroMechanical Systems, pp. 205¨C210, 2000.
P.T. Jones, G.C. Johnson, R.T. Howe, Statistical characterization of fracture of brittle MEMS materials, Proceedings of the International Society for Optical Engineering (SPIE) 3880, pp. 20–29, 1999.
T.T. Shih, An evaluation of the probabilistic approach to brittle design, Engineering Fracture Mechanics 13, pp. 257–271, 1980.
J.C.H. Spence, Y.M. Huang, O. Sankey, Lattice trapping and surface reconstruction for silicon cleavage on (111). Ab-initio quantum molecular dynamics calculations, Acta Metallurgica et Materialia 41 (10), pp. 2815–2824, 1993.
R. Perez and P. Gumbsch, An ab initio study of the cleavage anisotropy in silicon, Acta Materialia 48, pp. 4517–4530, 2000.
C.E. Inglis, Stresses in a plate due to the presence of cracks and sharp corners, Transactions of the Royal Institution of Naval Architects 60, pp. 219–230, 1913.
H. Neuber, Theory of Notch Stresses, Edwards Bros Inc. 1946.
S.G. Lekhnitskii, S.W. Tsai, T. Cheron, Anisotropic Plates, 2nd edition, Gordon and Breach Science Publishers, pp. 167, 1968.
M. Isida and K. Nakagawa, On the stress gradients in tension and bending of a perforated strip, Proceedings of the Third Japan National Congress for Applied Mechanics, pp. 1–4, 1954.
M. Isida, On the tension of a strip with a central elliptic hole, Transactions of the Japan Society of Mechanical Engineers 21, pp. 514, 1955.
N.N. Nemeth, L.M. Powers, L.A. Janosik, J.P Gyekenyesi, Lifetime reliability evaluation of structural ceramic parts with the CARES/LIFE computer program, Proceedings of the 34th AIAA/ASME/ASCE/ASC Structures, Structural Dynamics, and Materials Conference, April 19-21, 1993, La Jolla, California, pp.1634–1646, 1993.
P.F. Barbara, D. M. Adams, D. B. O’Connor, Characterization of organic thin film materials with near-field scanning optical microscopy (NSOM), Annual Reviews in Materials Science 29, pp. 433–469, 1999.
M.F. Yu, O. Lourie, M.J. Dyer, K. Moloni, T.F. Kelly, R.S. Ruoff, Strength and breaking mechanism of multiwalled carbon nanotubes under tensile load, Science 287 (5453), pp. 637–640, 2000.
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Chasiotis, I. (2004). Experimental Mechanics of MEMS and Thin Films. In: Harik, V.M., Luo, LS. (eds) Micromechanics and Nanoscale Effects. ICASE/LaRC Interdisciplinary Series in Science and Engineering, vol 10. Springer, Dordrecht. https://doi.org/10.1007/978-94-007-1013-9_1
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DOI: https://doi.org/10.1007/978-94-007-1013-9_1
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