Abstract
The automotive industry developments in the electrification of power train systems (i.e. HEVs and EVs), chassis systems (i.e. X-by wire systems) and auxiliaries (e.g. HVAC) have created a rapidly growing demand of advanced high temperature robust and reliable power electronics systems. This will require further efforts both in nanoelectronics semiconductor basic technologies and in system integration: power electronic system coming from industrial segments, need to be qualified against automotive requirements in term of reliability, robustness, safety and dependability. The paper gives an overview of the semiconductor technologies and integrated electronics for electrical power systems in particular for electric vehicles (EVs) and hybrid electric vehicles (HEVs). In addition it will discuss the mapping of the semiconductor technologies to the module electronics requirements aiming to the highest levels of reliability (target zero defects).
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References
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Acknowledgment
The work was supported by the ENIAC E3Car project under the project grant. The authors would also like to convey thanks to the Public Authorities and European Commission for providing the financial support. Reliability simulation research is done by ON Semiconductor in the frame of the MEDEA+ELIAS project funded by IWT in Belgium.
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© 2011 Springer Science+Business Media B.V.
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Vermesan, O. et al. (2011). Robust Design for High Temperature and High Voltage Applications. In: Casier, H., Steyaert, M., van Roermund, A. (eds) Analog Circuit Design. Springer, Dordrecht. https://doi.org/10.1007/978-94-007-0391-9_4
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DOI: https://doi.org/10.1007/978-94-007-0391-9_4
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