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Band Gap in Phononic Crystal Thin Plate with/without Mirror Plane

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IUTAM Symposium on Recent Advances of Acoustic Waves in Solids

Part of the book series: IUTAM Bookseries ((IUTAMBOOK,volume 26))

Abstract

The mechanism of opening a band gap in the free phononic crystal (PC) thin plate with or without a mirror plane is investigated. It is found that, in a PC plate with a mirror plane, the permitted modes can be separated into symmetric and antisymmetric modes, and the band gap in such a system can be opened by the interaction between the modes of the same kind and/or the breaking of the degeneracy of the mode at the edge of the Brillouin zone. However, for a PC plate without a mirror plane, mode separation can no longer be performed, and interaction can occur between any two permitted modes. As a result, a new kind of band gap can be opened.

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Author information

Authors and Affiliations

  1. Department of Physics, South China University of Technology, Wushan, Guangzhou, 510640, China

    Zhilin Hou

  2. Institut Jean Lamour, CNRS - Nancy University, BP: 239, Bd des Aiguillettes, 54506, Vnadoeuvre les Nancy, France

    Badreddine M. Assouar

Authors
  1. Zhilin Hou
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  2. Badreddine M. Assouar
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Corresponding author

Correspondence to Badreddine M. Assouar .

Editor information

Editors and Affiliations

  1. Institute of Applied Mechanics, Dept. Mechanical Engineering, National Taiwan University, Roosevelt Road 1, Taipei, 10617, Taiwan R.O.C.

    Tsung-Tsong Wu

  2. Dept. Mechanical Engineering, National Taiwan University, Roosevelt Rd. 1, Taipei, 106, Taiwan R.O.C.

    Chien-Ching Ma

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Hou, Z., Assouar, B.M. (2010). Band Gap in Phononic Crystal Thin Plate with/without Mirror Plane. In: Wu, TT., Ma, CC. (eds) IUTAM Symposium on Recent Advances of Acoustic Waves in Solids. IUTAM Bookseries, vol 26. Springer, Dordrecht. https://doi.org/10.1007/978-90-481-9893-1_30

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  • DOI: https://doi.org/10.1007/978-90-481-9893-1_30

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  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-90-481-9892-4

  • Online ISBN: 978-90-481-9893-1

  • eBook Packages: EngineeringEngineering (R0)

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