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Microfluidic Packaging Process

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Book cover CMOS Capacitive Sensors for Lab-on-Chip Applications

Part of the book series: Analog Circuits and Signal Processing ((ACSP))

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Abstract

A CMOS-based LoC system would require efficient microfluidic packaging to protect the circuitry from the biological and chemical analytes, as well as the external environment. Microfluidic packaging is also critical to direct the fluids towards the embedded sensors or actuators for analysis. Ideally, these microfluidic packaging components, including micro-channels, -chambers, -fittings, -valves and -pumps should be performed using a low temperature process with reliable hermetic bonding [278]. The leakage of analytes (especially of charged molecules, as is the case with many bioanalytes) from microfluidic components may increase the parasitic capacitances or resistances and thus affect the circuit characteristics.

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Authors and Affiliations

  1. Department of Electrical Engineering, Ecole Polytechnique de Montréal, Montreal, QC, Canada

    Ebrahim Ghafar-Zadeh & Mohamad Sawan

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  1. Ebrahim Ghafar-Zadeh
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Correspondence to Ebrahim Ghafar-Zadeh .

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Ghafar-Zadeh, E., Sawan, M. (2010). Microfluidic Packaging Process. In: CMOS Capacitive Sensors for Lab-on-Chip Applications. Analog Circuits and Signal Processing. Springer, Dordrecht. https://doi.org/10.1007/978-90-481-3727-5_5

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  • DOI: https://doi.org/10.1007/978-90-481-3727-5_5

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