Abstract
In this paper we present design, fabrication, and experimental characterization of microstrip antenna with copper nanofilm of 43 nm thicknesses as radiating element. The copper nanofilm patch is 15 times smaller than the skin-depth of copper at 10 GHz. The proposed antenna is non-contact feeding type proximity coupled microstrip patch antenna designed for ‘X’ band applications. The antenna design is validated with IE3D simulation software. The simulated antennas are fabricated for both 17 µm thickfilm and 43 nm nanofilm patches on low-cost 1.6 mm height FR4 substrate. The thickfilm antenna is fabricated using common photolithography, whereas copper nanofilm is fabricated using RF-sputtering deposition system at room temperature. The thickness and uniform distribution of copper nanofilm is confirmed by scanning electron microscope. The radiation result shows nanofilm antenna exhibits outstanding performance over thickfilm antenna in terms of bandwidth. The nanofilm antenna presents wide bandwidth of 47.29 % over thickfilm antenna.
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Acknowledgments
Authors acknowledge DST and UGC, Govt. of India for granting VNA and IE3D software under major research project to Gulbarga University. Author RRP gratefully acknowledges constant support from APPA IET Gulbarga, to carry out this work.
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Patil, R.R., Vani, R.M., Hunagund, P.V. (2016). Copper Nanofilm Antenna Design and Development: For X-Band Wireless Sensor Applications. In: Afzalpulkar, N., Srivastava, V., Singh, G., Bhatnagar, D. (eds) Proceedings of the International Conference on Recent Cognizance in Wireless Communication & Image Processing. Springer, New Delhi. https://doi.org/10.1007/978-81-322-2638-3_30
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DOI: https://doi.org/10.1007/978-81-322-2638-3_30
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