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A Study on Hydrophobicity of Silicon and a Few Dielectric Materials

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Micro and Smart Devices and Systems

Part of the book series: Springer Tracts in Mechanical Engineering ((STME))

Abstract

Superhydrophobic surfaces of silicon and a few dielectric materials were prepared by a combination of texturing and deposition of a self-assembled monolayer. The water contact angle and surface morphology of the prepared surfaces were investigated for a number of variations during the process of texturing. The combination of surface roughness and chemical treatment renders a lotus leaves-like effect called superhydrophobicity with a water contact angle (WCA) greater than 150°. The chapter also presents the basic concepts and models of hydrophobicity and discusses the use and importance of high k-dielectric materials as superhydrophobic surfaces in microelectronics and microfluidics. The wetting behaviours of water droplets on randomly structured hydrophobic surfaces were investigated. The effects of plasma and chemical treatment on structure geometry, roughness, and relative pore fraction on the contact angles were investigated experimentally for droplets of size comparable to the size of the structures. Moreover, we have successfully prepared superhydrophobic surfaces with various texturing methods.

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Acknowledgments

This work was carried out for NPMASS National MEMS Design Centre, BITS, Pilani, India. We acknowledge the support and funding from NPMASS project sanctions in HR PARC to establish a National MEMS Design Centre at our Institute. We would also like to thank Prof. K.N. Bhat, ECE, Indian Institute of Science, Bangalore for his support and guidance.

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Correspondence to N. N. Sharma .

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Kumar, V., Sharma, N.N. (2014). A Study on Hydrophobicity of Silicon and a Few Dielectric Materials. In: Vinoy, K., Ananthasuresh, G., Pratap, R., Krupanidhi, S. (eds) Micro and Smart Devices and Systems. Springer Tracts in Mechanical Engineering. Springer, New Delhi. https://doi.org/10.1007/978-81-322-1913-2_16

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  • DOI: https://doi.org/10.1007/978-81-322-1913-2_16

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