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A LabVIEW Based Data Acquisition System for Electrical Impedance Tomography (EIT)

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Proceedings of the Third International Conference on Soft Computing for Problem Solving

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 259))

Abstract

A LabVIEW based data acquisition system (LV-DAS) is developed for Electrical Impedance Tomography (EIT) for automatic current injection and boundary data collection. The developed LV-DAS consists of a NIUSB-6251 DAQ card, NISCB-68 connector module and an automatic electrode switching module (A-ESM). A LabVIEW based graphical user interface (LV-GUI) is develop to control the current injection and data acquisition by LV-DAS through A-ESM. Boundary data are collected for a number of practical phantoms and the boundary data profiles are studied to assess the LV-DAS. Results show that the high resolution NIDAQ card of the DAS improves its data acquisition performance with accurate measurement and high signal to noise ratio (SNR).

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Authors and Affiliations

  1. Department of Instrumentation and Applied Physics, Indian Institute of Science, Bangalore, India

    Tushar Kanti Bera & J. Nagaraju

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  1. Tushar Kanti Bera
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  2. J. Nagaraju
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Correspondence to Tushar Kanti Bera .

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Editors and Affiliations

  1. Department of Paper Technology, Indian Institute of Technology Roorkee, Roorkee, Uttarakhand, India

    Millie Pant

  2. Department of Mathematics, Indian Institute of Technology Roorkee, Roorkee, Uttarakhand, India

    Kusum Deep

  3. Department of Mathematics and Computer Science, Liverpool Hope University, Liverpool, United Kingdom

    Atulya Nagar

  4. Department of Applied Mathematics, South Asian University, New Delhi, India

    Jagdish Chand Bansal

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Bera, T.K., Nagaraju, J. (2014). A LabVIEW Based Data Acquisition System for Electrical Impedance Tomography (EIT). In: Pant, M., Deep, K., Nagar, A., Bansal, J. (eds) Proceedings of the Third International Conference on Soft Computing for Problem Solving. Advances in Intelligent Systems and Computing, vol 259. Springer, New Delhi. https://doi.org/10.1007/978-81-322-1768-8_34

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  • DOI: https://doi.org/10.1007/978-81-322-1768-8_34

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