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Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 258))

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Abstract

Today, there are two distinct branches for the design of System on Chips (SoC’s) and Embedded Systems. Yet, at the advent of systems that will do everything, all the time, everywhere the notions of SoC and embedded systems design need to grow and expand to encompass all of a system’s computational and physical elements. Often referred to as cyber-physical systems (CPS) when these two are combined, it is at the heart of design of the emerging smart energy grids, automotive domain, healthcare, entertainment, consumer applications, and more. The economic and societal potential is greater than that we have already witnessed with mobile consumer devices. The seeds of support for CPS will enable machine-to-machine systems, the Internet of Things, and more. What impact will this have on design? What might the EDA tools to design cyber-physical systems look like? And when will this happen?

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Correspondence to Dennis Brophy .

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© 2013 Springer India

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Brophy, D. (2013). Industry Trends and EDA Tool Vendor Readiness for New Inventions in Chip Design. In: Chakravarthi, V., Shirur, Y., Prasad, R. (eds) Proceedings of International Conference on VLSI, Communication, Advanced Devices, Signals & Systems and Networking (VCASAN-2013). Lecture Notes in Electrical Engineering, vol 258. Springer, India. https://doi.org/10.1007/978-81-322-1524-0_3

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  • DOI: https://doi.org/10.1007/978-81-322-1524-0_3

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  • Publisher Name: Springer, India

  • Print ISBN: 978-81-322-1523-3

  • Online ISBN: 978-81-322-1524-0

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