The Role of Underlayer Coating in 123 Films Deposited on Metallic Substrates
In this paper we discuss the results of Y1Ba2Cu3O7−δ thin films on metallic substrates, with YSZ buffer layers. Various metallic coatings, like Pd, Au, Ag in addition to previously used Pt, sandwitched between the substrate and the buffer layer are used, in order to elucidate the effect of such metallic under-layer coatings in detail. We show that the role of the metallic under-layer coating is in improving the surface morphology. A thin layer( 20nm) of these metals with their noble properties act as barrier for interaction between the substrate and the buffer layer, and thus finally improving the surface morphology. The detailed X-ray measurements reveal that the quality of the films were directly linked with the percentage mismatch between the lattice parameters of YSZ and 123 film. Two distinctly different grain morphologies are noticed. This difference is discussed in terms of film quality.
KeywordsBuffer Layer Metallic Substrate YBCO Film Coated Film Percentage Mismatch
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