Abstract
The purpose of this work is to investigate annealing process or conditions for Bi(Pb)-Sr-Ca- Cu-O sputtered films in order to promote the growth of the high-Tc phase. The composition of the specimen film was adjusted to the stoichiometry of the high-Tc phase (the atomic ratio of Bi :Pb:Sr:Ca:Cu = 1:0.2:1:1:1.5) by changing the composition of the target and sputtering conditions.
A new method, in which a MgO plate was put on the film surface, was developed to keep the concentration of Pb in the film during the anneal. The optimum annealing temperature was 830 ~ 850°C. A volume fraction of the high-Tc phase was attained above 70% in superconducting phases with good reproducibility. A preferential growth of c-axis perpendicular to the film was observed.
As a result,Tc of zero resistance of 105K and a critical current density in excess of 3x104 A/cm2 were achieved.
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References
M.K.Wu et a I,Phys.Rev.Lett.58,908(1987)
H.Maeda et al, Jpn. J. Appl. Phys. Vol 27 (1988)
J.M.Tarascon et al,Phys.Rev. Lett.38,8885(1988)
M.Takano et al,Jpn.J.Appl.Phys.Vol 27, L1041 (1988)
T.Kawai et al,Jpn.J.Appl.Phys.Vol 27,L1476 (1988)
K.Ogawa et al,Jpn.J.Appl.Phys.Vol 28,L967 (1989)
A.Tanaka et al,Appl.Phys.Lett.54,1362(1989)
T. Kawai et al, Jpn. J. Appl. Phys. Vol 28, L187 (1989)
T. Kawai et al, Jpn. J. Appl. Phys. Vol 28, L190 (1989)
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Maeda, K. et al. (1990). Growth and Property of High-Tc Phase in Bi(Pb)-Sr-Ca-Cu-O Sputtered Films. In: Ishiguro, T., Kajimura, K. (eds) Advances in Superconductivity II. Springer, Tokyo. https://doi.org/10.1007/978-4-431-68117-5_202
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DOI: https://doi.org/10.1007/978-4-431-68117-5_202
Publisher Name: Springer, Tokyo
Print ISBN: 978-4-431-68119-9
Online ISBN: 978-4-431-68117-5
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