Multi-Layered Superconducting YBa2Cu3Oy Thick Films on Y2BaCuO5 Substrate

  • Kiichi Yoshiara
  • Kenji Kagata
  • Tsutomu Hiroki
  • Kiyotaka Nakahigashi
Conference paper


Multi-layered superconducting YBa2Cu3Oy thick films have been prepared on Y2BaCuO5 substrate by the thick film method. The superconducting films were tightly bound with insulating Y2BaCuO5, Dy2BaCuO5 or Yb2BaCuO5 films and Y2BaCuO5 substrate by an anchor effect. The superconducting critical temperature (Tc) of the multi-layered films were 70K and 77K for the first and second layer respectively. The electric resistivity of the Y2BaCuO5, Dy2BaCuOs and Yb2BaCuO5 insulating films sandwitched by the superconducting YBa2Cu3Oy films were 104–107107Ω·cm.

The insulating materials used in the present studies seems to be preferable to the YBa2Cu3Oy thick film formations because of less interactions between the superconducting and the insulating films (or the substrate).


Flexural Strength Thick Film Diethylene Glycol Screen Printing Volume Resistivity 
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  1. [1]
    J.G.Bedonrz and K.A.Muller, Z.Phys.B64, 189 (1986).ADSCrossRefGoogle Scholar
  2. [2]
    M.K.Wu, J.R.Ashburn, C.J.Torng, P.H.Hor, R.L.Meng, L.Gao, J.Huang, Y.Q.Wang and C.W.Chu, Phys.Rev.Lett.58,908(1987).ADSCrossRefGoogle Scholar
  3. [3]
    H.Maeda, Y.Tanaka, Y.Fukutomi and T.Asano, Jpn.J.Appl.Phys.27,L209(1988).ADSCrossRefGoogle Scholar
  4. 14]
    Z.Z.Sheng, A.M.Hermann, Nature 332,55(1988).ADSCrossRefGoogle Scholar
  5. [5]
    T.Aida, T.Fukazawa, K.Kanke, Z.Wen, S.Yokoyama, H.Asano, Iguchi and E.Yamaka, Jpn.J.Appl.Phys.26, L1483(1987).CrossRefGoogle Scholar
  6. [6]
    Y.Enomoto, T.Murakami, M.Suzuki and K.Moriwaki, Jpn.J.Appl.Phys.26,L1248 (1987) .ADSCrossRefGoogle Scholar
  7. [7]
    M.Futamoto and Y.Honda, Jpn. J. Appl. Phys. 27, L73 (1988).ADSCrossRefGoogle Scholar
  8. [8]
    A.Nakayama, A.Inoue, K.Takeuchi and Y.Okabe, Jpn. J. Appl. Phys. 26, L2055 (1 987) .ADSCrossRefGoogle Scholar
  9. [9]
    H.Koinuma, T.Hashimoto, T.Nakanuma, K.Kishio, T.Kitazawa and K.FueKi, Jpn. J. Appl. Phys. 26, L761 (1987) .ADSCrossRefGoogle Scholar
  10. [10]
    M.Itoh and H.Ishigaki, Jpn. J. Appl. Phys. 27, L420 (1988).ADSCrossRefGoogle Scholar
  11. [11]
    R.C.Budharii, S.H.Tzeng, H.J.Doerr and R.F.Bunshah, Appl.Phys.Lett. 51, 1277(1987).ADSCrossRefGoogle Scholar
  12. [12]
    K.Yoshiara, K.Kagata, S.Yokoyama, T.Hiroki, H.Higuma, T.Yamazaki and K.Nakahigashi, Jpn. J. Appl. Phys. 29, L1 492 (1988) .Google Scholar
  13. [13]
    K.Nakahigashi, K.Yoshiara, M.Kogachi, S.Nakanishi, H.Sasakura, S.Minamigawa, N.Fukuoka and A.Yanase, Jpn. J. Appl. Phys. 27, L378 (1988).CrossRefGoogle Scholar

Copyright information

© Springer Japan 1989

Authors and Affiliations

  • Kiichi Yoshiara
    • 1
  • Kenji Kagata
    • 1
  • Tsutomu Hiroki
    • 1
  • Kiyotaka Nakahigashi
    • 2
  1. 1.Materials and Devices LaboratoryMitsubishi Electric CorporationAmagasaki, 661Japan
  2. 2.Department of Materials ScienceUniversity of Osaka PrefectureSakai, 591Japan

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