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Microwave Surface Resistance of YBa2Cu3Oy Thin Films Prepared by Inductive Coupled Plasma Sputtering

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Advances in Superconductivity XII

Abstract

The YBa2Cu3Oy (YBCO) film having low surface resistance (R s ) was prepared using an inductive coupled plasma sputtering technique. To increase the low deposition rate, a new self-template method was examined. The YBCO films fabricated on the 21-nm-thick template YBCO layer were c-axis oriented grain perfectly and successfully grew even at 3 times higher deposition rate. However, the R s was not low enough, due to the in-plane misaligned grains. Therefore, the BaSnO3 (BSO) buffer was used to obtain perfect in-plane aligned grains. The R s value of the YBCO/YBCO-template/BSO/MgO film was 0.38 mΩ at 35 K and 1.13 mΩ at 77 K in measurement frequency 22 GHz. The R s values scaled to 10 GHz were 0.08 mΩ at 35 K and 0.23 mΩ at 77 K, respectively.

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Authors and Affiliations

  1. Department of Electrical and Information Engineering, Yamagata University, 4-3-16 Johnan, Yonezawa, 992-8510, Japan

    T. Suzuki, S. Sato, M. Kusunoki, M. Mukaida & S. Ohshima

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  1. T. Suzuki
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  2. S. Sato
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  3. M. Kusunoki
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  4. M. Mukaida
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  5. S. Ohshima
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Editors and Affiliations

  1. New Industry Creation Hatchery Center, Research Institute of Electrical Communication, Tohoku University, 2-1-1 Katahira, 980-8577, Aoba-ku, Sendai, Japan

    Tsutomu Yamashita (Professor) (Professor)

  2. Superconductivity Research Laboratory, ISTEC, 1-10-13 Shinonome, 135-0062, Koto-ku, Tokyo, Japan

    Kei-ichi Tanabe (Director, Division 6) (Director, Division 6)

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© 2000 Springer Japan

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Suzuki, T., Sato, S., Kusunoki, M., Mukaida, M., Ohshima, S. (2000). Microwave Surface Resistance of YBa2Cu3Oy Thin Films Prepared by Inductive Coupled Plasma Sputtering. In: Yamashita, T., Tanabe, Ki. (eds) Advances in Superconductivity XII. Springer, Tokyo. https://doi.org/10.1007/978-4-431-66877-0_311

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  • DOI: https://doi.org/10.1007/978-4-431-66877-0_311

  • Publisher Name: Springer, Tokyo

  • Print ISBN: 978-4-431-70270-2

  • Online ISBN: 978-4-431-66877-0

  • eBook Packages: Springer Book Archive

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