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Advanced Materials Design via Low-Damage Plasma Processes

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Progress in Advanced Structural and Functional Materials Design

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Abstract

Low-damage plasma processing of materials is strongly desired for development of a variety of advanced devices with inorganic/organic hybrid materials structure (formation of inorganic functional layers on soft-materials substrate and/or stack layer formation with inorganic functional layers and organic functional layers), especially for development of flexible electronics, flat-panel displays, thin-film photovoltaic cells, biomaterials and microelectronics. For successful development of the organic/inorganic hybrid devices, low-temperature formation of high-quality inorganic functional layers (inorganic semiconductors and/or transparent conductive oxides) on soft materials and ultra-fine control of interface structure are required to avoid considerable degradation of soft materials. In this chapter, low-damage plasma processes have been described on the basis of plasma production with low-inductance antenna (LIA) modules to sustain radio-frequency inductively coupled discharges, which can provide one of the solutions to realize high-density and low-damage plasma production and active control of power deposition profiles over large area.

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Acknowledgments

This work was supported partly by The Global COE Program “Center of Excellence for Advanced Structural and Functional Materials Design” from the Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan.

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Authors and Affiliations

  1. Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka, 567-0047, Japan

    Yuichi Setsuhara

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  1. Yuichi Setsuhara
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Correspondence to Yuichi Setsuhara .

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Editors and Affiliations

  1. , Graduate School of Engineering, Osaka University, Yamada-oka, Suita 2-1, Osaka, 565-0871, Japan

    Tomoyuki Kakeshita

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Setsuhara, Y. (2013). Advanced Materials Design via Low-Damage Plasma Processes. In: Kakeshita, T. (eds) Progress in Advanced Structural and Functional Materials Design. Springer, Tokyo. https://doi.org/10.1007/978-4-431-54064-9_18

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