Auszug
Die typische Umgebung für die Entwicklung und Fertigung von mikrotechnischen Produkten ist der Reinraum. Er gewährleistet saubere Umgebungsbedingungen in Form von gefilterter Luft in dem Bereich, in dem Substrate partikelarm mit geeigneten Prozessmedien und -anlagen prozessiert und gehandhabt werden. Außerdem erfolgt in peripheren Einheiten die Bereitstellung aller erforderlichen Medien (z. B. Prozessgase, Druckluft, DI-Wasser, Kühlwasser, Stromversorgung, Vakuum) sowie die Entsorgung (toxische Abluft, Abwasserneutralisation). Der eigentliche Reinraum, die erforderliche Klimatechnik und die peripheren Einheiten bilden einen komplex organisierten, zusammenhängenden und mit Hilfe von Sensoren überwachten Bereich. Seine detaillierte Auslegung, geometrische Anordnung und Eigenschaften werden durch die Anwendung, d. h. die in dieser Fertigungsumgebung herzustellenden Produkte, definiert. Die Größe eines Reinraums kann dabei wenige Quadratmeter (z. B. für einen isolierten Mikromontageplatz) oder mehrere tausend Quadratmeter für eine komplette Prozesslinie (z. B. eine Speicherchipfertigung) betragen.
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Literatur
J. D. Andrade, Hydrogels for medical and Related Applications, Symposium of the 170th meeting of the American Chemical Society, 1975, American Chemical Society (1976)
Ph. Arquint, A. van den Berg, B. H. van der Schoot, N. F. de Rooij, H. Bühler, W. E. Morf, L. F. J. Dürselen, Sensors and Actuators B 13-14 (1993) 340–344
Ph. Arquint, M. Koudelka-Hep, D. J. Strike, P. D. van der Wal, B. H. van der Schoot, N. F. de Rooij, Materials for Microstructures: Polymers, in UETP-MEMS Course Materials for Microstructures, (1995)
P. Bachmann, D. Leers, H. Lydtin, Towards a general concept of diamond chemical vapor deposition, Diamond and Related Materials 1 (1991) 1–12
W. Benecke, Physikalische Effekte zur Signalwandlung, in A. Heuberger, Mikromechanik, Springer Verlag Berlin, Heidelberg (1991)
T. M. Benson, H.F. Arrand, P. Sewell, D. Niemeyer, A. Loni, R.J. Bozeat, M. Krüger, R. Arens-Fischer, M. Thönissen, H. Lüth, Progress towards achieving integrated circuit functionality using porous silicon optoelectronic components, Materials Science and Engineering B 69–70 (1999) 92
M. Bleicher, Halbleiter-Optoelektronik, Heidelberg, A. Hüthig Verlag (1986)
V. E. Bottom, Introduction to Quartz Crystal Unit Design, Van Nostrad Reinhold, New York (1982)
J. C. Brice, Crystals for quartz resonators, Review of Modern Physics 57 (1985) 105–146
W. G. Cady, Piezoelectricity, Vol. 1, Dover, New York (1964)
L. Canham, Silicon Quantum Wire Array Fabrication by Electrochemical and Chemical Dissolution of Wafers, Appl. Phys. Lett. 57 (1990) 1046
S. C. Chang, J. R. Stetter, C. S. Cha, Amperometric Gas Sensors Talanta-Oxford 40 (1993) 461
C. C. Chang, L. C. Chen, A new process for the fabrication of silicon-on-insulator structures by using porous silicon, Materials Letters 32 (1997) 287–290
J. S. Danel, F. Michel, G. Delapierre, Micromachining of Quartz and its Application to Acceleration Sensor, Sensors and Actuators A 21-23 (1990) 971–977
J. S. Danel und G. Delapierre, Quartz: a material for microdevices, J. Micromech. Microeng. (1991) 187–198
B. Diem, P. Rey, S. Renard, S. Viollet, H. Bono, F. Michel, M. T. Delaye, G. Delapierre, SOI „SIMOX“; from bulk to surface micromachining, a new age for silicon sensors and actuators, Sensors and Actuators A 46-47 (1995) 8
W. Ehrfeld, D. Münchmeyer, Threedimensional Microfabrication using Synchrotron Radiation, Nuclear Instr. and Methods in Physics Research A 303 (1991) 523–531
W. Ehrfeld, H. Lehr, Deep X-ray lithography for the production of threedimensional microstructures from metals, polymers and ceramics, Radiat. Phys. and Chem. 45 (1995) 394
F. Ericsson, S. Johansson, J.-A. Schweitz, Hardness and Fracture Toughness of Semiconducting Materials Studied by Indentation and Erosion Techniques, Mater. Sci. Eng. A 105/106 (1988) 131–141
F. Ericsson und J.-A. Schweitz, Micromechanical Fracture Strength of Silicon, J. Appl. Physics 68 (1990)5840–5844
J. E. Field, The Properties of Diamond, Academic Press, London (1979)
S. Gernet, M. Koudelka, N.F. de Rooij, Sensors and Actuators 18 (1989) 59–70
W. R. Gombotz, A.S. Hoffmann, Gas-Discharge Techniques for Biomaterial Modification, CRC Critical Reviews in Biocompatibility 4 (1987) 1–42
U. Gösele, V. Lehmann, Leuchtendes poröses Silizium, Phys. Bl. 50 (1994) 241–243
S. Green, P. Kathirgamanathan, The quenching of porous silicon photoluminescence by gaseous oxygen, Thin Solid Films 374 (2000) 98
H. J. Griesser, R. C. Chatelier, T.R. Gengenbach, Z. R. Vasic, G. Johnson, J.G. Steele, Plasma Surface Modifications for Improved Biocompatibility of Commercial Polymers, Polymer Internat. 27 (1992)109–117
U. Grüning, V. Lehmann, Appl. Phys. Lett. 66 (1995) 3254–3256
Th. Haase, Keramik, 2. Auflage, Leipzig: Deutscher Verlag für Grundstoffindustrie, (1968)
F. Hedrich, S. Billat, W. Lang, Structuring of membrane sensors using sacrificial porous silicon, Sensors and Actuators 84 (2000) 315
C. Hedlund, U. Bucht, J. Söderkvist, Two-dimensional etching diagrams for Z-cut quartz, J. Micromech. Microeng. 2 (1992) 215–127
C. Hedlund, U. Lindberg, U. Bucht und J. Söderkvist, Anisotropie etching of Z-cut quartz, J. Micromech. Microeng. 3 (1993) 65–73
H. W. Hennike, Zum Begriff Keramik und zur Einteilung keramischer Werkstoffe. Ber. Dtsch. Keram. Ges. 44 (1967) 209–211
K. Hjort, J. Söderqvist, J.-A. Schweitz, Gallium arsenide as a mechanical material, J. Micromech. Microeng. 4(1994) 1–13
A. S. Hoffmann, Biomeedical Applications of Plasma Gas Discharge Processes, J. Appl. Poly. Sci.: Appl. Poly. Sci. Symposium 251 (1988)
Produktinformation Fa. Holm Siliziumbearbeitung, Rosenheim
J. A. Hubbell, Chemical Modification of Polymer Surfaces to Improve Biocompatibility, Trends in Polymer Science 2 (1994) 20–25
N. Inagaki, S. Tasaka, H. Kawai, Improved Adhesion of poly(tetrafluorethylene) by NH3-plasma treatment, J. Adhes. Sci. Technol. 3(8) (1989) 637–649
C. Kittel, Einführung in die Festkörperphysik, R. Oldenbourg Verlag, München, Wien (1971)
W. Kleber, Einführung in die Kristallographie, Verlag Technik, Berlin (1990)
N. Koshida, X. Sheng, T. Komoda, Quasiballistic electron emission from porous silicon diodes, Appl. Surf. Sci. 661 (1999) 371–376
M. Koudelka, S. Gernet, N. F. de Rooij, Sensors and Actuators 18 (1989) 157–165
G. Lammel, Ph. Renaud, Free-standing, mobile 3D porous silicon microstructures, Sensors and Actuators 85 (2000) 356
W. Lang, P. Steiner, H. Sandmaier, Porous silicon: a novel material for microsystems, Sensors and Actuators A 51 (1995)31
V. Lehmann, U. Gösele, Porous Silicon Formation: A Quantum Wire Effect, Appl. Phys. Lett. 58 (1991)856
V. Lehmann, The Physics of Macropore Formation in Low Doped n-Type Silicon, J. Electrochem. Soc. 140(1993)2836
V. Lehmann, Porous Silicon-A New Material for MEMS, The 9th Annual Internat. Workshop on Micro Electro Mechanical Systems, MEMS 96, San Diego, USA (1996) 1
C. Levy-Clement, A. Lagoubi, R. Tenne, M. Neumann-Spallart, Photoelectrochemical Etching of Silicon, Electrochim. Acta 37 (1992) 877
Entwurf und Planung M.Lacher (IMM), Planungskontor A. Strickler, Oberrimsingen
R. Memming, G. Schwandt, Surf. Sci. 4 (1966) 109
G. J. Moody, R.B. Oke, J. D. R. Thomas, Analyst 95 (1970) 910
MRS Symp. Proc. 256, Light Emission from Silicon, (1992) u. 283, Microcrystalline Semiconductors, Mat. Sci. & Devices (1993)
mst news, Materials for Microsystems, No. 21, Sept. (1997)
J. Nieratschker, Fluorkunststoffe, Kunststoffe 86 (1996) 1524–1528
A. V. Nurmikko und R. L. Gunshor, Semiconductor Lasers with Wide-Gap II-VI Materials, in G. P. Agrawal (Ed.), Semiconductor Lasers, AIP Press, Woodbury, New York (1995)
G. Pfaender, Schott Glaslexikon, mvg Verlag, München, Landsberg am Lech, (1989)
Properties of Silicon, EMIS Datareviews Series No. 4, INSPEC (1988)
P. Rangsten, Microstructure Technology in Quartz and Silicon, Thesis, Uppsala University, (1998)
P. Rangsten, Etch rates of crystallographic planes in Z-cut quartz-experiments and simulation, J. Micromech. Microeng. 8 (1998) 1–6
H. Salmang, H. Scholze, Keramik, Teil 1 Allgemeine Grundlagen und wichtige Eigenschaften, 6. Auflage, Springer Verlag, Berlin, Heidelberg, New York (1982)
R. Sauer, Diamant als Elektronikmaterial, Phys. Bl. 51 (1995) 399–404
B. H. van der Schoot, S. Jeanneret, A. van den Berg, N.F. de Rooij, Sensors and Actuators B 15-16 (1993) 211–213; B.H. van der Schoot, S. Jeanneret, A. van den Berg, N.F. de Rooij, Analytical Methods and Instrumentation 1 (1993) 38–42
T. R. Dietrich, B. Speit, Schott Information 70 (1994) 6
Produktinformation der Fa. SICO Meiningen Wafer GmbH, Meiningen
R. L. Smith, S. D. Collins, Thick Films of Silicon Nitride, Sensors and Actuators A 23 (1990) 830
A. Splinter, J. Stürmann, W. Benecke, Novel porous silicon formation technology using internal current generation, Mat. Sci. and Engineering C 15 (2001) 109
A. Splinter, O. Bartels, W. Benecke, Thick porous silicon formation using implanted mask technology, Sensors and Actuators B 76 (2001) 354
A. Splinter, J. Stürmann, O. Bartels, W. Benecke, Micro membrane reactor: a flow-through membrane for gas pre-combustion, Sensors and Actuators B 83 (2002) 169–174
P. Steiner, W. Lang, Micromachining applications of porous silicon, Thin Solid Films 255 (1995) 52
EJ.R. Sudhölter, P. D. van der Wal, M. Skowronska-Ptasinska, A. van den Berg, P. Bergveld, D. N. Reinhoudt, Analytica Chimica Acta 230 (1990) 59–65
D. R. Turner, J. Electrochem. Soc. 105 (1958) 402
A. Uhlir, Bell Sys. Techn. Jour. 35 (1956) 333
T. Unagami, Formation Mechanism of Porous Silicon Layer by Anodization in HP Solution, J. Electrochem. Soc. 127 (1980) 476
W. Vogel, Glaschemie (4. Aufl.), Springer Verlag, Berlin, Heidelberg (1992)
Y. Watanabe, Y. Arita, T. Yokoyama, Y. Igarashi, Formation and Properties of Porous Silicon and Its Applications, J. Electrochem. Soc. 122 (1975) 1351
R. Williams, Modern GaAs processing techniques, Artech House, Boston, London (1990)
Produktinformation Fa. Wafer Technology, UK
A. Zeitschel, A. Friedberger, W. Weiser, G. Müller, Breaking the isotropy of porous silicon formation by means of current focusing, Sensors and Actuators 74 (1999) 113
X. G. Zhang, J. Electrochem. Soc. 138 (1991) 3750
Produktinformationen der Fa. Albis Plastic GmbH, Hamburg
Produktinformation der Fa. BASF, Ludwigshafen, Produktname TERLURAN
Produktinformation der Fa. Nippon Zeon Co., Tokyo, Japan, Produktname ZEONEX 280/250
Produktinformation der Fa. Du Pont de Nemours Int. S. A., Genf, Schweiz, Produktname Teflon PFA
Produktinformation der Fa. Hoechst, Frankfurt, Produktname TOPAS
Produktinformation der Fa. Hoechst, Frankfurt, Produktname VECTRA
Produktinformation der Fa. ICI, Hertfordshire, England, Produktname VICTREX
Literatur
R. L. Abber, Photochemical Vapor Deposition, in K. K. Schuegraf (Ed.), Handbook of Thin Film Deposition Processes and Techniques, Noyes Publications, Park Ridge, New Jersey (1988) 270–290
Thin Film Stress Monitoring, Aerospace Engineering-Warrendale, Vol. 16 (1996) 36
J. E. E. Baglin, G. J. lark, Nucl. Instr. and Meth. in Phys. Res. B 7/8 (1985) 881
N. Basta, Firmeninformation High Technology, Febr. (1985)
H. Biedermann, Y. Osada, Plasma Chemistry of Polymers, Advances in Polymer Science 95, Springer Verlag Berlin, Heidelberg (1990)
J. Bloehm, W. A. P. Claassen, Nucleation and Growth of silicon film by chemical vapour deposition, Philips Techn. Rev. 41 (1983/84) 60–69
A. N. Broers, Photolithography, in: CEI-Course 136, Silicon Semiconductor Materials and Process Technology, CEI-Europe/Elsevier, (1991)
W. Brockmann (Hrsg.), Haftung als Basis für Stoffverbunde und Verbund-werkstoffe, Symp. Dt. Ges. Metallkunde, Bremen, Oberursel (1983)
J. D. Buckley, C. Karatzas, Proc. SPIE 1088 (1989) 424
B. N. Chapman, Thin-film adhesion, J. Vac. Sci. Technol. 11 (1974) 106–113
R. Dammel, C. R. Lindley, W. Meier, G. Pawlowski, J. Their, W. Henke, Proc. SPIE 1264 (1990) 26
R. Dammel, Diazonaphthoquinone-based Resists, Tutorial Texts in optical Eng., Vol. TT 11, SPIE Opt. Eng. Press, Washington, (1993)
R. Dammel, Applications of Thick Photoresists, AZ Electronic Materials, Clariant Corporation, Presentation at the K. Suss Advanced Packaging Seminar, Denver, CO (2000)
B. E. Deal, A.S. Grove, General Relationship for the Thermal Oxidation of Silicon, J. Appl. Phys. 36 (1965) 3770
G. Dearnaley, Nucl. Instr. and Meth. in Phys. Res. B 7 (1985) 158
d ′Heurle, Diffusion-Reaction: The Oxidation of Silicides in Elektronics and Elswhere, J. Phys. III France 5 (1995) 1707–1728
DIN 4774: Messung der Wellentiefe mit elektrischen Tastschnittgeräten, Hrsg. Deutscher Normenausschuß
J. C. Dyment, J. C. North, L. A. Dásaro, J. Appl. Phys. 44 (1973) 207
M. Esselborn, Charakterisierung und Simulation eines DUV-Prozesses, Diplomarbeit FH Köln/IBM Speichersysteme Deutschland GmbH Mainz, (2002)
H. Frey, G. Kienel (Hrsg.), Dünnschichttechnologie, VDI-Verlag Düsseldorf (1987)
E. Garmire, H. Stoll, A. Yariv, R. Hunsperger, Appl. Phys. Lett. 21 (1972) 87
C. M. Garza, C. R. Szmanda, R. L. Fischer, Proc. SPIE 920 (1988) 321
N. Goldsmith, J. Olmstead, J. Scott, Boron Nitride as a Diffusion Source for Silicon, RCA Review, 28 (1967) 344
W. Görgen, Prozessentwicklung zur Herstellung teilbeweglicher MikroStrukturen mit dem LIGA-Verfahren, Diplomarbeit, FH Wiesbaden (1995)
M. Hatzakis, K. J. Stewart, J. M. Shaw, S. A. Rishton, J. Electrochem. Soc. 138 (1991) 1076
T. Hattori, Silicon Native Oxide, J. Surface Finishing Soc. of Jap., Vol.45 (1994) 12
K. Hjort, G. Thornell, J.A. Schweitz, R. Spohr, Quartz micromachining by lithographic control of ion track etching, Appl. Phys. Lett. 69 (1996) 3435–3436
G. H. Hubler, F.A. Smidt, Nucl. Instr. and Meth. in Phys. Res. B 7/8 (1985) 151
S. F. Hung, L.J. Chen, The Oxidation behaviors of MoSi2 on (111) Si, Applied Surface Science 113/114(1997)600–604
R. Hurditch, I. Daraktchiev, Positive Photoresist Solvents, Semicon Europe, Zurich, (1994)
S. Jacobsen, B. Jönsson, B. Sundqvist, Thin Solid Films 107 (1983) 89
R. Jacobsson, Measurement of the adhesion of thin films, Thin Solid Films 34 (1976) 191–199
K. Jain, Eximer Laser Lithography, SPIE Opt. Eng. Press, Bellingham, (1990)
K. Jinno et al., Photogr. Sci. Eng. 21 (1977) 290
W. Karthe, R. Müller, Integrierte Optik, Akademische Verlagsgesellschaft Geest & Portig KG, Leipzig, (1991)
L.E. Katz in S.M. Sze, VLSI Technology, McGraw-Hill Book Company, New York, (1988)
V. C. Kempson et al., Microelectron. Eng. 13 (1991) 287
C. T. Kemmerer, R.H. Mills, Adhesion of thin films of evaporated titanium-copper after electroplating, J. Vac. Sci. Technol. 16 (1979) 352–355
D. Kissinger, Experimente zur Simulation von DUV-Lithographieprozessen, Diplomarbeit FH Wiesbaden/IBM Speichersysteme Deutschland GmbH Mainz, (2002)
T. T. Kodas. M.J. Hampden-Smith. The Chemistry of Metal CVD, VCH Verlagsgesellschaft, Weinheim (1994)
M. Kogure, Native Oxide Growth and Organic Impurity Removal on Si Surface with Ozone Injected Ultrapure Water, J. Electrochem. Soc, Vol. 140 (1993) 804
M. Köhler, Ätzverfahren für die Mikrotechnik, Wiley-VCH, Weinheim (1998)
K. Komvopoulos, B. Wie, Nanoscale indentation Hardness and Wear Characterization of Hydrogenated Carbon Thin Films, Transactions American Soc. of Mech. Eng. J. of Tribology, Vol. 117 (1995) 594
M. Kraus, M. Leghissa, G. Saemann-Ischenko, Wechselspiel linienhafter Objekte in der Nanowelt, Phys. Bl. 50(1994)333–338
J. R. Kruest, The characterization of Boron Nitride Using Hydrogen Injection, Thesis, Dep. Electrical Engineering Pennsylvania State University (1976)
O. Lehmann, R.A. Fischer, M. Stuke, Laser Direct Writing of ß-Co/Ga and Mo/Ga Alloy Microstructures from Organometallic Single Source Precursors, Advanced Materials for Optics and Electronics, Vol.6 (1996)27
R. Leuschner, G. Pawlowski, in: R.W. Cahn, P. Haasen, E. J. Kramer (eds.), Materials Science and Technology, Vol. 16, Processing of Semiconductors, VCH Verlagsgesellschaft mbH, Weinheim, (1996)
M. D. Levenson, Microlith. World 1(1) (1992) 7
B. J. Lin, Proc. SPIE 1264 (1990) 2
J. Linhard, M. Scharff, H. E. Schiott, Mat. Fys. Medd. Dan. Vid. Selsk. 33 (1963)
C. Koch, T. Rinke, Lithographie-Prozesse, MicroChemicals GmbH, Ulm (2004)
C. A. Mack, Inside Prolith-A Comprehensive Guide to Optical Lithography Simulation, FINLE Technologies Inc., (1997)
C. A. Mack, M. Ercken, M. Moelants, Matching Simulation and Experiment for Chemically Amplified Resists, FINLE Technologies Inc., (1999)
L. I. Maissel, R. Glang, Handbook of Thin Film Technology, New York, McGraw-Hill, (1970)
Mask Aligner MA6, Technical Description, Karl Süss KG GmbH&Co., München, (1996)
Yoji Mashiko, Akihiko Ashaki, Tatsuo Akamoto, Koji Fukumoto, Hirosi Koyama, Formation Mechanisms of the Deformed Oxide Layer in a Tungsten Polycide Structure, Jap. J. Appl. Phys., Vol. 35 (1996) 584–588
S. Matsuo, Microwave Electron Cyclotron Resonance Plasma Chemical Vapor Deposition, in K. K. Schuegraf (Ed.), Handbook of Thin Film Deposition Processes and Techniques, Noyes Publications, Park Ridge, New Jersey (1988)147–169
K. Mayr, Herstellung eines Nanowerkzeuges in Form einer dreidimensional beweglichen Feldemissionsspitze auf der Basis eines streßoptimierten Mehrschichtsystems, Diplomarbeit, Fachhochschule Wiesbaden (1994)
D. Meyerhofer, IEEE Trans. Electr. Dev. ED-27 (1980) 921
M. C. B. A. Michielsen et al., Microelectronic Eng. 11 (1990) 475
Microsystem Technology, Technical Description, Karl SUss KG GmbH & Co., München, (1996)
W. A. Moreau, Semiconductor Lithography-Principles, Practices, and Materials, Plenum Press, New York, (1988)
B. A. Movchan, A. V. Demchishin, Study of the structure and properties of thick condensates of nickel, titanium, tungsten, aluminum oxide and zirconium dioxide, Fiz. Metal. Metalloved 28 (1969) 653–660
V. S. Nguyen, Plasma-Assisted Chemical Vapor Deposition, in K. K. Schuegraf (Ed.), Handbook of Thin Film Deposition Processes and Techniques, Noyes Publications, Park Ridge, New Jersey (1988)112–146
M.-A. Nicolet, S.S. Lau, in VLSI Electronics, Microstructure Science, N.G. Einspruch and G.B. Larrabee, Eds., Academic Press, New York, (1983)
G. Oerlein, Reactive Ion Etching, in S.M. Rossnagel, J.J. Cuomo, W.D. Westwood (Eds.), Handbook of Plasma Processing Technology, Noyes Publications, Park Ridge, New Jersey, (1990)
A. Offenhäuser, J. Rühe, W. Knoll, Neural cells cultured on modified microelectronic device surfaces, J. Vac. Sci. Technol. A 13(5) (1995) 2606–2612
T. Oguwa et al., Proc. SPIE 1924 (1993) 273
A. C. Ouano, in: T. Davidson (ed.), Polymers in Microelectronics, ACS Symp. Ser. 242, Washington, (1984)
G. Pawlowski et al., Proc. SPIE 1262 (1990) 391
G. Petzow, ätzen, Materialkundlich-Technische Reihe 1, Gebr. Bornträger, Berlin, Stuttgart (1994)
C. Pierrat et al., Microelectr. Eng. 11 (1990) 507
J. F. Rabek, Mechanisms of Photophysical and Photochemical Reactions in Polymers: Theory and Practical Applications, Wiley, New York, (1987)
P. Rai-Choudhury, Handbook of Microlithography, Micromachining and Microfabrication (Volume 1: Microlithography), SPIE-The International Society for Optical Engineering, (1997)
A. Reiser, Photoreactive Polymers: The Science and Technology of Resists, Wiley, New York, (1989)
B. Roland, R. Lombaerts, J. Vandendrissche, F. Godts, Proc. SPIE 1262 (1990) 151
R. C. Rossi, Low Pressure Chemical Vapor Deposition, in K. K. Schuegraf (Ed.), Handbook of Thin Film Deposition Processes and Techniques, Noyes Publications, Park Ridge, New Jersey (1988) 80
S.M. Rossnagel, J.J. Cuomo, W.D. Westwood, Handbook of Plasma Processing Technology, Noyes Publications, Park Ridge, New Jersey, (1990)
E. W. Rutter et al., Proc. Int. Conf. Multichip Modules, Denver USA, (1992)
H. Ryssel, I. Rüge, Ionenimplantation, Teubner Verlag, Stuttgart, (1978)
T. Sato, K. Ohata, N. Asahi, Y. Ono, Y. Oka, I. Hashimoto, J. Vac. Sci. Technol. A 4(3) (1986)
M. Sebald, R. Leuschner, R. Sezi, H. Ahne, S. Birkle, Proc. SPIE 1262 (1990) 528
J. Segner, Plasma impulse chemical vapour deposition-a novel technique for the production of high power laser mirrors, Materials Science and Engineering, A 140 (1991) 733–740
R. Sezi et al., Techn. Paper at the SPIE Reg. Conf. On Photopolymers, Ellenville USA, (1994) TF4
J. R. Sheats, B. W. Smith, Microlithography-Science and Technology, Marcel Dekker Inc., New York, (1998)
S. Shimizu, Res. Dev. Rev. Mitsubishi Kasei Corp. 2(2) (1988) 85
F. A. Smidt, B. D. Sartwell, Nucl. Instr. and Meth. in Phys. Res. B 6 (1985)
S. M. Spitzer, J. C. North, J. Appl. Phys. 44 (1973) 214
R. D. Standley, W. M. Gibson, J. W. Rodgers, Applied Optics 11 (1972) 1313
M. Stuke, Laser applications in CVD, J. de Physique 4, Vol. 3 (1993) C3–501
M. Stuke, O. Lehmann, Threedimensional laser direct writing of electrical conducting and isolating microstructures, Materials Letters, Vol. 21 (1994) 131
M. Stuke, O. Lehmann, Laser-CVD 3D Rapid Prototyping of Laser Driven Movable Micro-Objects, J. de Physique 4, Vol. 5 (1995) C5–601
T. Sugita, K. Awazu, M. Nishi, Evaluation of Hardness of Superhard Thin Films by Analysis of Indentation Behavior with a Vickers Indentor, J. Jap. Soc. Prec. Eng., Vol. 61 (1995) 1290
L. F. Thompson, C. G. Willson, M. J. Bowden, Introduction to Microlithography, ACS Symp. Ser. 219, Washington, (1983)
G. Thornell, K. Hjort, B. Studer, J.-A. Schweitz, Anisotropy-Independent Through Micromachining of Quartz Resonators by Ion Track Etching, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, Vol. 44 (1997) 829–838
J. A. Thornton, Influence of apparatur geometry and deposition conditions on the structure and topography of thick sputtered coatings, J. Vac. Sci. Technol. 11 (1974) 666–670
J. A. Thornton, Influence of substrate temperature and deposition rate on structure of thick sputtered coatings, J. Vac. Sci. Technol. 12 (1975) 830–835
H. J. Timpe, H. Baumann, Photopolymere: Prinzipien und Anwendungen, Deutscher Verlag für Grundstoffindustrie, Leipzig, (1988)
T. A. Tombrello, Mat Sci. and Eng. 69 (1985) 443
M. A. Toukhy, T. R. Sarubbi, D. J. Brzozowy, Proc. SPIE 1466(1991) 497
P. Trefonas et al., Proc. SPIE 920 (1988) 203
T. Tsurushima, H. Tanoue, J. Phys. Soc. Jap. 31 (1971) 1965
Plasma polymerization of silicon organic membranes for gas separation, Surface and Coatings Technology 59 (1993) 342–344
C. Wohlrab, M. Hofer, Plasmapolymerisation für Hartbeschichtung von Kunststofflinsen, Vakuum in Forschung und Praxis Nr. 2 (1995) 97–105
S. M. Yalisove, Z. U. Rek, J. C. Bilello, Analysis of thin film stress measurement techniques, Thin Solid Films, Vol. 301 (1997) 45
M. Yanagisawa, Hardness and Elasticity Measurement of Thin Films with Nanoindenter, Jap. J. of Tribology, Vol. 40 (1995) 139
J. F. Ziegler, J. P. Biersack, U. Littmark: The Stopping And Range of Ions in Solids, Pergamon Press (1985)
J. F. Ziegler, Nucl. Instr. and Meth. in Phys. Res. B 6 (1985) 270
J. L. Zilko, Metal-Organic Chemical Vapor Deposition: Technology and Equipment, in K. K. Schuegraf (Ed.), Handbook of Thin Film Deposition Processes and Techniques, Noyes Publications, Park Ridge, New Jersey (1988) 234
Literatur
S. Abel, Charakterisierung von Materialien zur Fertigung elektromagnetischer Mikroaktoren in LIGA-Technik, Dissertation, Universität Kaiserslautern (1996)
M. S. Antelmann, The Encyclopedia of Chemical Electrode Potentials, Plenum Press, New York, (1982)
J. Arnold, U. Dasbach, W. Ehrfeld, K. Hesch, H. Löwe, Combination of Excimer Laser Micromachining and Replication Processes Suited for Large Scale Production (Laser-LIGA), Applied Surface Science 86 (1995) 251–258
D. Bäuerle, Laser Processing and Chemistry, Springer, Berlin (2000)
H.-D. Bauer, D. Sabbert, Mikromaterialbearbeitung mit Ultraviolett-und Infrarotlasern, Laser in der Anwendung, Spektrum der Wissenschaft 2 (1998) 45–49
U. Becher, Untersuchungen zur teilautomatisierten Abscheidung von Nickel-Phosphor-Legierungen in MikroStrukturen, Dissertation, TU Ilmenau (1994)
E. W. Becker, W. Ehrfeld, P. Hagmann, A. Maner, D. Münchmeyer, Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming and plastic moulding (LIGA process), Microelectronic Engineering 4 (1986) 35–56
J. K. Bhardwaj und H. Ashraf, Advanced Silicon Etching Using High Density Plasmas, Proc. SPIE Micromachining and Microfabrication Process Technology, Vol. 2639 (1995) 224–233
J. Bhardwaj, H. Ashraf, A. McQarrie, Dry Silicon Etching for MEMS, Presented at the Symposium on Microstructures and Microfabricated Systems at the Annual Meeting of the Electrochemical Society, Montreal, Quebec, Canada, May 4-9 (1997)
I. Brodie, J. J. Muray, The Physics of Microfabrication, Plenum Press, New York (1982)
R. Brück, N. Rizvi, A. Schmidt, Angewandte Mikrotechnik, Hanser, München (2001)
R. Brugger, Die galvanische Vernickelung, Eugen Leutze Verlag, Saulgau, 2. Auflage (1984)
J. Bühler, F.-P. Steiner, H. Baltes, Silicon dioxide sacrificial layer etching in surface micro-machining, J. Micromech. Microeng. 7 (1997) R1–R13.
D. R. Ciarlo, A latching accelerometer fabricated by the anisotropic etching of (110) oriented silicon wafers, J. Micromech. Microeng. 2 (1992) 10–13
M. Despont, H. Lorenz, N. Fahrni, J. Brugger, P. Renaud und P. Vettiger, High-Aspect-Ratio, Ultrathick, Negative-Tone Near-UV Photoresist for MEMS Applications, Proc. 10th IEEE Workshop on MEMS, Nagoya, Japan (1997) 518–522
T. Diehl, M. Lacher, T. Zetterer, Abschlußbericht zum BMBF-Verbundvorhaben „Mikrooptische Spektrale Meßgeräte als Komponenten für Satelliten und terrestrische Anwendungen“, Teilprojekt „Design und dUnnschichttechnologische Herstellung der HADAMARD-Spiegelzeile“, FKZ 50 TT 9521(1997)
B. Diem, P. Rey, S. Renard, S. Viollet Bosson, H. Bono, F. Michel, M. T. Delaye, G. Delapierre, SOI’ sIMOX’:from bulk to surface micromachining, a new age for silicon sensors and actuators, Sensors and Actuators A 46-47 (1995) 8–16
T.R. Dietrich, Photostructurable glass, in UETP-MEMS-Course: Photostructuring of glass, organized by FSRM, Neuchatel (1998)
P. N. Dunn, Solid State Technology (1993)32
W. Ehrfeld, D. Münchmeyer, Three-dimensional microfabrication using synchrotron radiation, Nuclear Instr. and Methods in Physics Research A 303 (1991) 523–531
W. Ehrfeld, H. Lehr, Deep X-ray Lithography for the Production of Three-dimensional Microstructures from Metals, Polymers and Ceramics, Radiation Physics and Chemistry, Vol. 45 (1995), 349–365
W. Ehrfeld, H. Lehr, F. Michel, A. Wolf, Micro Electro Discharge Machining as a Technology in Micromachining and Microfabrication, Proc. SPIE 2879, Bellingham (1996) 332–337
W. Ehrfeld (Hrsg.), Handbuch Mikrotechnik, Hanser, München (2002)
H. G. A. Elderstig, L. Rosengren, Y. Baecklund, Fabrication of 45° Mirrors Together with Well-Defined V-Grooves Using Wet Anisotropic Etching of Silicon, J. Microelectromechanical Systems, Vol. 4 (1995) 213
M. Elwenspoek, Physical Chemistry of wet chemical anisotropic etching of silicon, Proc. ASME Dynamic Systems and Control Division, DSC-Vol. 57-2 (1995) 901–908
P. Enoksson, New structure for corner compensation in anisotropic KOH etching, J. Micromech. Microeng. 7 (1997) 141–144
G. Feiertag, Röntgentiefenlithographische Mikrostrukturfertigung: Genauigkeit der Abbildung und Strukturierung durch Schrägbelichtung, Dissertation, Univ. Bonn (1996)
G. Feiertag, W. Ehrfeld, H. Freimuth, H. Kölle, H. Lehr, M. Schmidt, Fabrication of photonic crystals by deep x-ray lithography, Applied Physics Letters 71 (1997) 1441–1443
M. Gerner, Realisierung nichtlinear-mikrooptischer Demonstratoren unter Verwendung der LIGA-Technik und deren Charakterisierung, Dissertation, TH Darmstadt (1995)
G. Goet, Metallische MikroStrukturen durch UV-Lithographie und elektrolytische Legierungsabscheidung, Diplomarbeit, FH Wiesbaden (2001)
M. C. Gower, P.T. Rumbsby und D.T. Thomas, Proc. SPIE 1835 (1992) 133
W. Görgen, Prozessentwicklung zur Herstellung teilbeweglicher MikroStrukturen mit dem LIGA-Verfahren, Diplomarbeit, FH Wiesbaden (1995)
V. Hessel, W. Ehrfeld, H. Freimuth, V. Haverkamp, H. Löwe, Th. Richter, M. Stadel, A. Wolf, Fabrication and Interconnection of Ceramic Microreaction Systems for High Temperature Applications, in W. Ehrfeld (Ed.) Microreaction Technology, Springer Verlag, Berlin, Heidelberg (1998)
V. P. Jaecklin, Surface micromachined electrostatic actuators, Dissertation, Universität Neuchatel, Schweiz, (1994)
H. Jansen, M. de Boer, R. Legtenberg, M. Elwenspoek, The black silicon method: A universal method for determining the parameter setting of a fluorine-based reactive ion etcher in deep silicon trench etching with profile control, Proc. Micro Mechanics Europe (MME’ 94) Pisa, (1994) 60–64
H. Jansen, M. de Boer, J. Burger, R. Legtenberg, M. Elwenspoek, The black silicon method II: the effect of mask material and loading on the reactive ion etching of deep silicon trenches, Microelectronic Engineering, Vol. 27 (1995) 475–480
J. Kaiser, Entwicklung eines Verfahrens zur Herstellung von Filtern mittels Photolithographie und Galvanik unter Verwendung eines Wafersteppers, Diplomarbeit, FH Köln (1995)
R. P. van Kampen, R. F. Wolffenbuttel, Effects of 110-oriented corner compensation structures on membrane quality and convex corner integrity in (100)-silicon using aqueous KOH, J. Micromech. Microeng. 5 (1995) 91–94
J.-M. Kim et al., Continuous anti-stiction coatings using self-assembled monolayers for gold microstructures, Jour. Micromech. Microeng. 12 (2002) 688–695
B. Kloeck, S. D. Collins, N.F. de Rooij, R.L. Smith, Study of the electrochemical etch stop for high precision thickness control of silicon membranes, Transaction on Electron devices, Vol. 36 (1989)
B. Kloeck, Design, fabrication and characterization of piezoresistive pressure sensors, including the study of electrochemical etch stop, Dissertation, Universität Neuchatel, (1989)
F. K. Kneubühl, M. W. Sigrist, Laser, Teubner Studienbuch Physik, Stuttgart (1989)
M. Köhler, Ätzverfahren für die Mikrotechnik, Wiley-VCH, Weinheim (1998)
K. Y. Lee, N. LaBianca, S. A. Rishton, S. Zolgharnain, J. D. Gelorme, J. Shaw, T. H. P. Chang, J. Vac. Sci. Technol. B 13(6) (1995) 3012–3016
R. Legtenberg, H. Jansen, M. de Boer, und M. Elwenspoek, Anisotropic RIE of Si using SF6/O2/CHF3 Gasmixtures, J. Electrochem. Soc. Vol. 142 (1995) 2020
C.-H. Lin et al., A new fabrication process for ultra-thick microfluidic microstructures utilizing SU-8 photoresist, Jour. Micromech. Microeng. 12 (2002) 590–597
Y. Linden, L. Tenerz, J. Tiren, B. Hök, Sensors and Actuators 16 (1989) 67
H. Lorenz, M. Despont, N. Farni, J. Brugger, P. Vettiger, P. Renaud, High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS, Sensors and Actuators A 64 (1998) 33–39
H. Lorenz, M. Laudon, P. Renaud, Mechanical Characterization of a New High-Aspect-Ratio Near UV-Photoresist, Microelectronic Engineering 41/42 (1998) 371–374
H. Löwe, H. Mensinger, W. Ehrfeld, Galvanoformung in der LIGA-Technik, Jahrbuch Oberflächentechnik, Metall Verlag Heidelberg, Band 50 (1994) 77–95
S. M. Metev, V. P. Veiko, Laser Assisted Microtechnology, Springer, Berlin (1994)
F. Michel, W. Ehrfeld, H. Lehr, A. Wolf, H.-P. Gruber, A. Bertholds, Tagungsband Internat, wiss. Kolloquium der TU Ilmenau (1996)41
B. Nikpour, L.M. Landsberger, T.J. Hubbard, M. Kahrizi, A. Iftimie, Concave corner compensation between vertical (010)-(001) planes anisotropically etched in Si (100), Sensors and Actuators A 66 (1998) 299–307
G. Oerlein, Reactive Ion Etching, in S.M. Rossnagel, J.J. Cuomo, W.D. Westwood (Eds.), Handbook of Plasma Processing Technology, Noyes Pu blications, Park Ridge, New Jersey, (1990)
H. L. Offereins, H. Sandmaier, K. Marusczyk, K. Kühl, A. Plettner, Compensating corner undercutting of (100) silicon in KOH, Sens. Mater. 3 (1992) 127–144
G. Petzow, Ätzen, Materialkundlich-Technische Reihe 1, Gebr. Bornträger, Berlin,Stuttgart (1994)
H. M. Phillips, D. L. Callahan, S. P. LeBlanc, Z. Ball und R. Sauerbrey, Mater. Res. Soc. Symp. Proc. 285 (1993) 169
N. F. Raley, Y. Sugiyama, T. van Duzer, J. Electrochem. Soc. 131 (1984) 161
I. W. Rangelow, R. Kassing, Silicon Microreactors made by reactive Ion Etching, in W. Ehrfeld (Ed.) Microreaction Technology, Springer Verlag, Berlin, Heidelberg (1998)
A. Reismann, M. Berkenblit, S.A. Chan, F.B. Kaufman, D.C. Green, The controlled etching of silicon in catalyzed ethylendiamine-pyrocatechol-water solutions, J. Electrochem. Soc. 126 (1979) 1406
R. Schenk, O. Halle, K. Müllen, W. Ehrfeld, M. Schmidt, Highly Sensitive Resist Material for Deep-X-ray Lithography, Microelectronic Engineering 35 (1997) 105–108
A. Schmidt, Röntgentiefenlithographische Mikrostrukturfertigung: Elektroneninduzierte Sekundäreffekte und MehrfachbelichtungsProzess, Dissertation, Univ. Bonn (1996)
T. R. Dietrich, B. Speit, Schott Information 70 (1994) 6
H. Seidel, L. Csepregi, Three-dimensional Structuring of Silicon for Sensor Applications, Sensors and Actuators 4 (1983) 455–463
H. Seidel, L. Csepregi, A. Heuberger, H. Baumgärtel, Anisotropic etching of crystalline silicon in alkaline solutions, J. Electrochem. Soc. 137 (1990) 3612–3625
H. Seidel, Naßchemische Tiefenätztechnik. in A. Heuberger (Hrsg.), Mikromechanik, Springer Verlag, Berlin, Heidelberg (1991)
W. M. van Spengen, R. Puers, I. De Wolf, A physical model to predict suction in MEMS, Jour. Micromech. Microeng. 12 (2002) 702–713
M. Stadel, H. Freimuth, V. Hessel und M. Lacher, Abformung keramischer MikroStrukturen, Keram. Z. 48 (1996) 12
M. Stepputat, F. Schmitz, M. Abraham, Abschlußbericht „Miniaturisierter Sonnensensor“, Teilbe-richt: „Mikrosystemtechnische Komponenten für miniaturisierte Sonnensensoren“, FKZ 50TT 9529 (1997)
C. Strandman, L. Rosengren, Y. Bäcklund, Fabrication of 45° optical Mirrors on (100) Si using wet anisotropic etching, IEEE (1995) 244
H.-B. Sun, Nature 412 (2001) 697
N. Tas, T. Sonnenberg, H. Jansen, R. Legtenberg, M. Elwenspoek, Suction in surface micromachining, J. Micromech. Microeng. 6 (1996) 385–397
M. Teubert, Anwendungstechnische Untersuchungen photostrukturierbarer Resists mit Schichtdicken über 100 (μ m für die LIGA-Technik, Diplomarbeit, FH Köln (1996)
J. T. L. Thong, W. K. Choi, C.W. Chong, TMAH etching of silicon and the interaction of etching parameters, Sensors and Actuators A 63 (1997) 243–249
Y. Uenishi, M. Tsugai, M. Mehregany, Micro-opto-mechanical devices fabricated by anisotropic etching of (110) silicon., J. Micromech. Microeng. 5 (1995) 305–312
M. Vangbo, Y. Bäcklund, Precise mask alignment to the crystallographic orientation of silicon wafers using wet anisotropic etching, J. Micromech. Microeng. 6 (1996) 279–284
K. D. Wise, Silicon Micromachining and Its Application to High Performance Integrated Sensors, in C. D. Fung, P. W. Cheung, H. W. Ko, D. G. Fleming (Eds.), Micromachining and Micropackaging of Transducers, Elsevier, New York (1985)
A. Wolf, W. Ehrfeld, H. Lehr, F. Michel, M. Nienhaus, H.-P. Gruber, Combining LIGA and Electro Discharge Machining for the generation of complex micro structures in hard materials, Proceedings of 9-IPES/UME 4 Conference, Braunschweig (1997)
A. Wolf, W. Ehrfeld, H. Lehr, F. Michel, T. Richter, H. P. Gruber, O. Wörz, Mikroreaktorfertigung mittels Funkenerosion, F&M Feinwerktechnik, Mikrotechnik, Meßtechnik 105 (1997) 436–439
T. Zetterer, LIGA-Technology: Mask Requirements and Fabrication, UETP-MEMS Course LIGA-Technique (1998)
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(2006). Basistechnologien der Mikrosystemtechnik. In: Praxiswissen Mikrosystemtechnik. Vieweg+Teubner. https://doi.org/10.1007/978-3-8348-9105-1_2
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