Skip to main content
SpringerLink
Log in

Technology CAD at IBM

  • Conference paper
Technology CAD Systems

Abstract

The IBM suite of TCAD tools for semiconductor process and device modeling is described. The series includes FEDSS for process modeling, FIELDAY for device modeling, FOXi/FIERCE for resistance and capacitance calculation, EXCALIBR and MGP for compact device model generation, and SEMM for soft-error failure probability prediction. Comprising the VATS series of tools, the programs interact through a common database representation, are accessible via a graphics-user-interface WIZARD, and provide for inputs, outputs, and meshing through a number of pre- and post-processor programs.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 39.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 54.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. R.W. Knepper, S.P. Gaur, F.Y. Chang, and G.R. Srinivasan, “Advanced bipolar transistor modeling: Process and device simulation tools for today’s technology”, IBM J. R & D, Vol. 29, No. 3, pp. 218–228, May 1985.

    Article  Google Scholar 

  2. R.R. O’Brien, C.M. Hsieh, J.S. Moore, R.F. Lever, P.C. Murley K. W. Brannon, G. R. Srinivasan, and R. W. Knepper, “Two-dimensional process modeling: A description of the SAFEPRO program”, IBM J. R & D, Vol. 29, No. 3, pp. 229–241, May 1985.

    Article  Google Scholar 

  3. S.P. Gaur, P.A. Habitz, Y.J. Park, R.K. Cook, Y.S. Huang, and L.F. Wagner, “Two-Dimensional Device Simulation Program: 2DP”, IBM J R & D, Vol. 29, No. 3, pp. 242–251, May 1985.

    Article  Google Scholar 

  4. F.Y. Chang and L.F. Wagner, “The generation of three-dimensional bipolar transistor models for circuit analysis”, IBM J R & D, Vol. 29, No. 3, pp. 252–262, May 1985.

    Article  Google Scholar 

  5. R.W. Knepper, “Problems in High Performance Bipolar Device Modeling”, Proc of the 1987 IEEE Bipolar Circuits and Technology Meeting, pp. 1–4, September 1987.

    Google Scholar 

  6. E. Rorris, R.R. O’Brien, F.F. Morehead, R.F. Lever, J.P. Peng, and G.R. Srinivasan, “A New Approach to the Simulation of the Coupled Point-Defects and Impurity Diffusion”, IEEE Trans CAD, vol. 9, pp. 1114–1122, October 1990.

    Google Scholar 

  7. R.W. Knepper, “Modeling Advanced Bipolar Devices for High Performance Applications”, 1990 IEEE IEDM Technical Digest, pp. 177–180, December 1990.

    Google Scholar 

  8. E.M. Buturla and P.E. Cottrell, “Two-Dimensional Finite Element Analysis of Semiconductor Transport Phenomena”, Int. Conf. on Numerical Methods in Electric and Magnetic Field Problems, Santa Margherita, Liguria, Italy, June 1976.

    Google Scholar 

  9. E.M. Buturla, P.E. Cottrell, B.M. Grossman, and K.A. Salsburg “Finite-Element Analysis of Semiconductor Devices: The FIELDAY Program”, IBM J. R & D, vol. 25, pp. 218–231, 1981.

    Article  Google Scholar 

  10. K.A. Salsburg, P. E. Cottrell, and E. M. Buturla, “FIELDAY Finite Element Device Analysis”, Proc of the NATO Advanced Study Institute Course on Process and Device Simulation, Urbino, Italy, July 1982.

    Google Scholar 

  11. K.A. Salsburg and H.H. Hansen, “FEDSS-Finite Element Diffusion Simulation System”, IEEE Trans. Electron Devices ED-30, p. 1004, Sept. 1983.

    Google Scholar 

  12. L. Borucki, H. Hansen, and K. Varahramyan, “FEDSS-A 2D semiconductor fabrication process simulator”, IBM J of R & D, Vol. 29, No. 3, pp. 263–276, May 1985.

    Article  Google Scholar 

  13. P.E. Cottrell and E.M. Buturla, “VLSI Wiring Capacitance” IBM J. R & D, vol. 29, no. 3, pp. 277–288, May 1985.

    Article  Google Scholar 

  14. E. Buturla, J.B. Johnson, and S. Furkay, “A New 3D Device Simulation Formulation”, NASECODE VI, Dublin, Ireland, July 1989.

    Google Scholar 

  15. D.C. Cole, E.M. Buturla, S.S. Furkay, et al., “The Use of Simulation in Semiconductor Technology Development”, Solid-State Electronics, vol. 33, no. 6, pp. 591–623, 1990.

    Article  Google Scholar 

  16. S. Furkay, et al., “Process and Device Simulation of a BICMOS Technology”; E. Buturla and S. Furkay, “DRAM Design with an Integrated Process and Device Simulation System”; E. Buturla and S. Furkay, “3D Device Modeling Short Course”, 1992 NASECODE Conference, Vienna, Austria, May 1992.

    Google Scholar 

  17. K.H. Brown, D. A.Grose, R.C. Lange, T.H. Ning, P.A. Totta, “Advancing the state of the art in high-performance logic and array technology”, IBM J of R & D: Vol. 36, No. 5, pp. 821–828, Sept. 1992.

    Article  Google Scholar 

  18. R.R. O’Brien, J. Peng, and C.S. Murthy, Unpublished work.

    Google Scholar 

  19. D. Chin, S.Y. Oh, and R.W. Dutton, “A General Solution Method for Two-Dimensional Nonplanar Oxidation”, IEEE Trans. Electron Devices ED-30, pp. 993 ff, 1983.

    Google Scholar 

  20. J.F. Ziegler, J.P. Biersack, and U. Littmark, “The Stopping and Range of Ions in Solids”, vol. 1, Pergamon Press, New York, 1984.

    Google Scholar 

  21. J. Slinkman and S. Furkay, Unpublished results.

    Google Scholar 

  22. W. Lee, S.E. Laux, M.V. Fischetti, G. Baccarani, A. Gnudi, J. Mandelman, J. M. C. Stork, and E. F. Crabbe, “Numerical modeling of advanced semiconductor devices”, IBM J. R & D, vol. 36, no. 2, pp. 208–232, March 1992.

    Article  Google Scholar 

  23. D.A. Sunderland, “An Algorithm for Calibrating Computer Models from Simulated or Measured Data”, submitted for publication in IEEE Trans. CAD

    Google Scholar 

  24. M.M. Pelella, et al., “A Comparative Device and Performance Analysis Between a SiGe Epitaxial-Base HBT and a Si Double Poly I/I BJT npn Structure”, IEEE BCTM Digest of Technical Papers, pp. 46–49, October 1992.

    Google Scholar 

  25. L. Wagner and M. Pelella, unpublished results.

    Google Scholar 

  26. J. Comfort, et al., 1990 IEDM Technical Digest, p. 21; G. Patton, et al. 1990 IEDM Technical Digest, p. 13.

    Google Scholar 

  27. J. Warnock, et al., IEEE Electron Device Letters, Vol. 12, p. 315, 1991.

    Article  Google Scholar 

  28. G.A. Sai-Halasz, M.R. Wordeman, and R.H. Dennard, “Alpha Particle-Induced Soft Error Rate in VLSI Circuits”, IEEE Trans ED, vol. 29, p. 725, 1982.

    Article  Google Scholar 

  29. C.M. Hsieh, P.C. Murley, and R.R. O’Brien, “A Field-funneling Effect on the Collection of Alpha-particle-Generated Carriers in Silicon Devices”, IEEE Electron Device Letters, Vol. 2, No. 4, pp. 103–105, April 1981

    Article  Google Scholar 

  30. C.M. Hsieh, P.C. Murley, and R.R. O’Brien, “Collection of Charge from Alpha-Particle Tracks in Silicon Devices”, IEEE Trans. ED, Vol. 3, No. 6, pp. 686–693, June 1983.

    Article  Google Scholar 

  31. G. R. Srinivasan, “Modeling Methodology for Both Cosmic Rays and Alpha Particle Induced Soft Fails in Integrated Circuit Chips”, to be published.

    Google Scholar 

  32. P. C. Murley, R. R. O’Brien, H. H. K. Tang, and G. R. Srinivasan, “Soft error Monte-Carlo Model”, to be published.

    Google Scholar 

  33. L. B. Freeman, “Soft Error Rate Investigation - Critical Charge Calculations for a Bipolar Array Cell ”, to be published.

    Google Scholar 

  34. W. A. Klaasen, “Modeling Sea Level Soft Error Rate in Dynamic RAMS”, to be published.

    Google Scholar 

  35. H. H. K. Tang, G. R. Srinivasan, and N. Azziz, Phys. Rev. C, vol. 42, p. 1598, 1990.

    Article  Google Scholar 

  36. J.K. Ousterhout, “TCL: An Embeddable Command Language”, Proc. 1990 Winter USENIX Conference, pp. 133–146, 1990.

    Google Scholar 

  37. J. K. Ousterhout, “An X11 Toolkit Based on the TCL Language”, Proc. 1991 Winter USENIX Conference, pp. 105–115, 1991.

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. IBM Semiconductor Research and Development Center, East Fishkill Facility, Hopewell Junction, NY, 12533, USA

    R. W. Knepper, J. B. Johnson, S. Furkay, J. Slinkman, X. Tian, E. M. Buturla, R. Young, G. Fiorenza, R. Logan, Y. S. Huang, R. R. O’Brien, C. S. Murthy, P. C. Murley, J. Peng, H. H. K. Tang, G. R. Srinivasan, M. M. Pelella, D. A. Sunderland, J. Mandelman, D. Lieber, E. Farrell & M. Kurasic

  2. IBM Technology Products Division, Burlington, VT, USA

    J. B. Johnson, S. Furkay, J. Slinkman, X. Tian & E. M. Buturla

  3. IBM SRDC, Hopewell Junction, NY, USA

    R. Young, G. Fiorenza, R. Logan, Y. S. Huang, R. R. O’Brien, C. S. Murthy, P. C. Murley, H. H. K. Tang, G. R. Srinivasan, M. M. Pelella, D. A. Sunderland & J. Mandelman

  4. AMC, Santa Barbara, CA, USA

    J. Peng

  5. IBM T.J. Watson Res. Lab., Yorktown Heights, NY, USA

    D. Lieber, E. Farrell & M. Kurasic

Authors
  1. R. W. Knepper
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. J. B. Johnson
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. S. Furkay
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. J. Slinkman
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. X. Tian
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. E. M. Buturla
    View author publications

    You can also search for this author in PubMed Google Scholar

  7. R. Young
    View author publications

    You can also search for this author in PubMed Google Scholar

  8. G. Fiorenza
    View author publications

    You can also search for this author in PubMed Google Scholar

  9. R. Logan
    View author publications

    You can also search for this author in PubMed Google Scholar

  10. Y. S. Huang
    View author publications

    You can also search for this author in PubMed Google Scholar

  11. R. R. O’Brien
    View author publications

    You can also search for this author in PubMed Google Scholar

  12. C. S. Murthy
    View author publications

    You can also search for this author in PubMed Google Scholar

  13. P. C. Murley
    View author publications

    You can also search for this author in PubMed Google Scholar

  14. J. Peng
    View author publications

    You can also search for this author in PubMed Google Scholar

  15. H. H. K. Tang
    View author publications

    You can also search for this author in PubMed Google Scholar

  16. G. R. Srinivasan
    View author publications

    You can also search for this author in PubMed Google Scholar

  17. M. M. Pelella
    View author publications

    You can also search for this author in PubMed Google Scholar

  18. D. A. Sunderland
    View author publications

    You can also search for this author in PubMed Google Scholar

  19. J. Mandelman
    View author publications

    You can also search for this author in PubMed Google Scholar

  20. D. Lieber
    View author publications

    You can also search for this author in PubMed Google Scholar

  21. E. Farrell
    View author publications

    You can also search for this author in PubMed Google Scholar

  22. M. Kurasic
    View author publications

    You can also search for this author in PubMed Google Scholar

Editor information

Editors and Affiliations

  1. Institut für Mikroelektronik, Technische Universität Wien, Austria

    Franz Fasching , Stefan Halama  & Siegfried Selberherr ,  & 

Rights and permissions

Reprints and permissions

Copyright information

© 1993 Springer-Verlag/Wien

About this paper

Cite this paper

Knepper, R.W. et al. (1993). Technology CAD at IBM. In: Fasching, F., Halama, S., Selberherr, S. (eds) Technology CAD Systems. Springer, Vienna. https://doi.org/10.1007/978-3-7091-9315-0_2

Download citation

  • DOI: https://doi.org/10.1007/978-3-7091-9315-0_2

  • Publisher Name: Springer, Vienna

  • Print ISBN: 978-3-7091-9317-4

  • Online ISBN: 978-3-7091-9315-0

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics

Search

Navigation