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Technology CAD at IBM

  • R. W. Knepper
  • J. B. Johnson
  • S. Furkay
  • J. Slinkman
  • X. Tian
  • E. M. Buturla
  • R. Young
  • G. Fiorenza
  • R. Logan
  • Y. S. Huang
  • R. R. O’Brien
  • C. S. Murthy
  • P. C. Murley
  • J. Peng
  • H. H. K. Tang
  • G. R. Srinivasan
  • M. M. Pelella
  • D. A. Sunderland
  • J. Mandelman
  • D. Lieber
  • E. Farrell
  • M. Kurasic

Abstract

The IBM suite of TCAD tools for semiconductor process and device modeling is described. The series includes FEDSS for process modeling, FIELDAY for device modeling, FOXi/FIERCE for resistance and capacitance calculation, EXCALIBR and MGP for compact device model generation, and SEMM for soft-error failure probability prediction. Comprising the VATS series of tools, the programs interact through a common database representation, are accessible via a graphics-user-interface WIZARD, and provide for inputs, outputs, and meshing through a number of pre- and post-processor programs.

Keywords

Device Modeling Device Simulation Soft Error Circuit Analysis Guard Ring 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag/Wien 1993

Authors and Affiliations

  • R. W. Knepper
    • 1
  • J. B. Johnson
    • 1
    • 2
  • S. Furkay
    • 1
    • 2
  • J. Slinkman
    • 1
    • 2
  • X. Tian
    • 1
    • 2
  • E. M. Buturla
    • 1
    • 2
  • R. Young
    • 1
    • 3
  • G. Fiorenza
    • 1
    • 3
  • R. Logan
    • 1
    • 3
  • Y. S. Huang
    • 1
    • 3
  • R. R. O’Brien
    • 1
    • 3
  • C. S. Murthy
    • 1
    • 3
  • P. C. Murley
    • 1
    • 3
  • J. Peng
    • 1
    • 4
  • H. H. K. Tang
    • 1
    • 3
  • G. R. Srinivasan
    • 1
    • 3
  • M. M. Pelella
    • 1
    • 3
  • D. A. Sunderland
    • 1
    • 3
  • J. Mandelman
    • 1
    • 3
  • D. Lieber
    • 1
    • 5
  • E. Farrell
    • 1
    • 5
  • M. Kurasic
    • 1
    • 5
  1. 1.IBM Semiconductor Research and Development CenterEast Fishkill FacilityHopewell JunctionUSA
  2. 2.IBM Technology Products DivisionBurlingtonUSA
  3. 3.IBM SRDCHopewell JunctionUSA
  4. 4.AMCSanta BarbaraUSA
  5. 5.IBM T.J. Watson Res. Lab.Yorktown HeightsUSA

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