Abstract
In order to meet the requirements of advanced process and device design, a new generation of TCAD frameworks is emerging These are based on a data level providing a common data interchange format. Such a format must be suitable for building simulation databases, and needs to be accompanied by supporting tools and by a procedural interface with multi-language bindings for data storage and retrieval by application programs. The complexity and scope of a rigorous TCAD framework requires special efforts to create a system which is both transparent to the user and comprehensible to the programmer. A consistent architecture and strict adherence to general software engineering guidelines can contribute significantly to the solution of this problem. We discuss general requirements and architectural issues of the data level, the user interface and the task level environment, and present their implementation in VISTA, the Viennese Integrated System for Technology CAD Applications.
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References
F. Fasching, W. Tuppa, and S. Selberherr. VISTA — The Data Level. IEEE Trans.Computer-Aided Design, 1993 (in publication).
S. Halama, F. Fasching, H. Pimingstorfer, W. Tuppa, and S. Selberherr. Consistent User Interface and Task Level Architecture of a TCAD System. In Proc.NUPAD IV, pp 237–242, 1992.
M.R. Simpson. PRIDE: An Integrated Design Environment for Semiconductor Device Simulation. IEEE Trans. Computer-Aided Design, 10 (9): 1163–1174, 1991.
E.W. Scheckler, A.S. Wong, R.H. Wang, G. Chin, J.R. Camanga, A.R. Neureuther, and R.W. Dutton. A Utility-Based Integrated System for Process Simulation. IEEE Trans. Computer-Aided Design, 11 (7): 911–920, 1992.
A.S. Wong. Technology Computer-Aided Design Frameworks and the PROSE Implementation. PhD thesis, University of California, Berkeley, 1992.
J.K. Ousterhout. Tcl: an Embeddable Command Language. In 1990 Winter USENIX Conference Proceedings, pp 133–146, 1990.
J.K. Ousterhout. An X11 Toolkit Based on the Tcl Language. In 1991 Winter USENIX Conference Proceedings, pp 105–115, 1991.
H. Matsuo, H. Masuda, S. Yamamoto, and T. Toyabe. A Supervised Process and Device Simulation for Statistical VLSI Design. In Proc.NUPAD III, pp 59–60, 1990.
P. Lloyd, H.K. Dirks, E.J. Prendergast, and K. Singhal. Technology CAD for Competitive Products. IEEE Trans. Computer-Aided Design, 9 (11): 1209–1216, 1990.
H. Jacobs, W. Hänsch, F. Hofmann, W. Jacobs, M Paffrath, E. Rank, K. Steger, and U. Weinert. SATURN–A Device Engineer’s Tool for Optimizing MOSFET Performance and Lifetime. In Proc.NUPAD III, pp 55–56, 1990.
C.H. Corbex, A.F. Gerodolle, S.P. Martin, and A.R. Poncet. Data structuring for process and device simulations. IEEE Trans. Computer-Aided Design, CAD-7: 489–500, 1988.
D.M.H. Walker, C.S. Kellen, D.M. Svoboda, and A.J. Strojwas. The CDB/HCDB semiconductor wafer representation server. IEEE Trans.ComputerAided Design, CAD-12: 283–295, 1993.
A.S. Wong and A.R. Neureuther. The Intertool Profile Interchange Format: A Technology CAD Environment Approach. IEEE Trans.Computer-Aided Design, 10 (9): 1157–1162, 1991.
D.S. Boning, M.L. Heytens, and A.S. Wong. The Intertool Profile Interchange Format: An Object-Oriented Approach. IEEE Trans. Computer-Aided Design, 10 (9): 1150–1156, 1991.
SWR Working Group of the CFI/TCAD TSC. Semiconductor Wafer Representation Architecture. CAD Framework Initiative, Austin, Texas, USA, 1.0 edition, 1992.
D. Boning, G. Chin, R. Cottle, W. Dietrich, S. Duvall, M. Giles, R. Harris, M. Karasick, N. Khalil, M. Law, M.J.McLennan, P.K. Mozumder, L. Nackman, S. Nassif, V.T. Rajan, D. Schröder, R. Tremain, D.M.H. Walker, R. Wang, and A. Wong. Developing and Integrating TCAD Applications with the Semiconductor Wafer Representation. In Proc.NUPAD IV, pp 199–204, 1992.
S.G. Duvall. An Interchange Format for Process and Device Simulation. IEEE Trans. Computer-Aided Design, CAD-7(7): 741–754, 1988.
P.J. Asente and R.R. Swick. X Window System Toolkit, The Complete Programmer’s Guide and Specification. Digital Press, 1990.
D.M.Betz. XLISP: An Object-Oriented Lisp, Version 2.1, 1989
R. Stallman. GNU Emacs Manual, 1986.
AUTOCAD Release 11 Reference Manual, 1990. Publication AC11RM.E1.
N. Mayer. WINTERP: An object-oriented rapid prototyping, development and delivery environment for building user-customizable applications with the OSF/Motif UI Toolkit. Technical report, Hewlett-Packard Laboratories, Palo Alto, 1991.
F. Fasching, C. Fischer, S. Selberherr, H. Stippel, W. Tuppa, and H. Read. A PIF Implementation for TCAD Purposes. In Fichtner and Aemmer [30], pp 477–482.
J. L. Hennessy and D. A. Patterson. Computer Architecture: A Quantitative Approach. Morgan Kaufmann Publisher Inc., 1990.
P.H. Winston and B.K.P. Horn. Lisp. Addison Wesley, 1989.
Institute for Microelectronics, Technical University Vienna, Gußhausstraße 2729, 1040 Wien, AUSTRIA. PAI Release, 1.0 edition, 1992.
OSF/Motif Programmer’s Guide, Release 1. 1, 1991.
H. Pimingstorfer, S. Halama, S. Selberherr, K. Wimmer, and P. Verhas. A Technology CAD Shell. In Fichtner and Aemmer [30], pp 409–416.
J. Daniell and S.W. Director. An Object Oriented Approach to CAD Tool Control. IEEE Trans.Computer-Aided Design, 10 (6): 698–713, 1991.
W. Fichtner and D. Aemmer, editors. Simulation of Semiconductor Devices and Processes, volume 4, Konstanz, 1991. Hartung-Gorre.
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Halama, S. et al. (1993). The Viennese Integrated System for Technology CAD Applications. In: Fasching, F., Halama, S., Selberherr, S. (eds) Technology CAD Systems. Springer, Vienna. https://doi.org/10.1007/978-3-7091-9315-0_10
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DOI: https://doi.org/10.1007/978-3-7091-9315-0_10
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