3D Simulation of Topography and Doping Processes at FhG

  • J. Lorenz
  • E. Bär
  • A. Burenkov
  • W. Henke
  • K. Tietzel
  • M. Weiß
Conference paper


This paper outlines activities carried out at FhG-IIS-B and FhG-ISiT on the development of algorithms and physical models required for the accurate three-dimensional simulation of topography and doping steps in semiconductor technology. The three-dimensional process simulation modules are being developed as parts of the SOLID and the PROMPT process simulation systems.


Dopant Profile Doping Process Sticking Coefficient Step Coverage Dopant Distribution 
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Copyright information

© Springer-Verlag/Wien 1995

Authors and Affiliations

  • J. Lorenz
    • 1
  • E. Bär
    • 1
  • A. Burenkov
    • 1
  • W. Henke
    • 2
  • K. Tietzel
    • 1
  • M. Weiß
    • 2
  1. 1.Fraunhofer-Institut für Integrierte SchaltungenBauelementetechnologie (FhG-IIS-B)ErlangenGermany
  2. 2.Fraunhofer-Institut für Siliziumtechnologie (FhG-ISiT)ItzehoeGermany

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