Three-Dimensional Simulation of Thermal Processes

  • Mark E. Law
  • Stephen Cea


Three-dimensional simulation of thermal processes is performed using the Florida Object Oriented Process Simulator (FLOOPS). Algorithms for three-dimensional grid update, moving boundaries, and solution of equations are described. The major challenge in building a 3D simulator is addressing the grid requirements, and the approach used in FLOOPS will be described. As process simulators move to three-dimensions, new parts of the simulator become CPU limiting. Some of these problems will be discussed and addressed. Since this is an area of on-going work, our current research directions will also he discussed.


Thermal Process Newton Iteration Surface Patch Node Object Diffusion Simulation 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Springer-Verlag/Wien 1995

Authors and Affiliations

  • Mark E. Law
    • 1
  • Stephen Cea
    • 1
  1. 1.Dept. of Electrical EngineeringUniversity of FloridaGainesvilleUSA

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