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Three-Dimensional Topography Simulator: 3D-MULSS and Its Applications

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3-Dimensional Process Simulation

Abstract

This paper introduces a three-dimensional topography simulator:3D-MULSS and its applications. We focus on the description of the material surface and the surface advancement, and then we present a 3D-MULSS model, with consideration to the probe size of observation, and based on the integration formula of the balance equation. Next, we show the simulation results of the 3D-MULSS: isotropic deposition, Aluminum-sputter deposition, isotropic etching, anisotropic etching, BPSG flow and sequential process steps. These results make the accuracy of the 3D-MULSS clear, and also show that it is possible to stably simulate the sequential process steps.

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© 1995 Springer-Verlag/Wien

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Fujinaga, M., Kotani, N. (1995). Three-Dimensional Topography Simulator: 3D-MULSS and Its Applications. In: Lorenz, J. (eds) 3-Dimensional Process Simulation. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6905-6_1

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  • DOI: https://doi.org/10.1007/978-3-7091-6905-6_1

  • Publisher Name: Springer, Vienna

  • Print ISBN: 978-3-7091-7430-2

  • Online ISBN: 978-3-7091-6905-6

  • eBook Packages: Springer Book Archive

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