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Influence of the Poly Gate Depletion Effect on Programming EEPROM Cells

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Simulation of Semiconductor Processes and Devices 1998

Abstract

To ensure a data retention time of e.g. 10 years a maximum allowed floating gate doping concentration can not be exceeded. The data retention time can be improved by reducing the floating gate doping concentration. This reduction causes a so far negligible depletion effect in the floating gate reducing the V T -shift by approximately 1.5 Volts at a floating gate doping of 3.1019 cm-3. A trade-off will be discussed.

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References

  1. H. Watanabe et al., Scaling of Tunnel Oxide Thickness for Flash EEPROMs Realizing Stress-Induced Leakage Current Reduction, Symposium on VLSI Technology Digest of Technical Papers, p. 47. 1994

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  2. N. D. Arora, R. Rios and C.-L. Huang, Modeling the Poly silicon Depletion Effect and Its Impact on Submicrometer CMOS Circuit Performance. Transactions on Electron Devices, vol. 42, No. 5, May 1995

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  3. Luey Chwan Liong and Po-ching Liu, A Theoretical Model for the Current-Voltage Characteristics of a Floating-Gate EEPROM Cell, Transactions on Electron Devices, vol. 40, no. 1, January 1993

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© 1998 Springer-Verlag/Wien

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Schuler, F., Klein, P., Hoffmann, K., Kowarik, O. (1998). Influence of the Poly Gate Depletion Effect on Programming EEPROM Cells. In: De Meyer, K., Biesemans, S. (eds) Simulation of Semiconductor Processes and Devices 1998. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6827-1_92

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  • DOI: https://doi.org/10.1007/978-3-7091-6827-1_92

  • Publisher Name: Springer, Vienna

  • Print ISBN: 978-3-7091-7415-9

  • Online ISBN: 978-3-7091-6827-1

  • eBook Packages: Springer Book Archive

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