Correlation of Finite Element Stress Simulations with Electromigration-Induced Fractures in Tungsten Plug Structures
Finite element stress simulations are used to explain the origin of cracks and the related increase in via resistance in tungsten plug structures. The simulations suggest that stress evolution during electromigration induced depletion can explain this new failure mechanism in interconnect structures using tungsten plugs.
KeywordsAnti Reflection Coating Lucent Technology Finite Element Stress Wafer Curvature Thermal Mismatch Stress
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