Abstract
This paper discusses the modeling and simulation of power MOSFET’s using large signal device simulation. In order to provide an accurate representation of an LDMOS MOSFET, a model for the intrinsic device and the extrinsic parasitic components is developed. The RF performance of the model is then verified with experimental data. With the proven model, the effect of parasitic components is analyzed and the matching networks are optimized for the desired response.
This is a preview of subscription content, log in via an institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsPreview
Unable to display preview. Download preview PDF.
References
G. Ma, W. Burger, C. Dragon, and T. Gillenwater. “High Efficiency LDMOS Power FET for Low Voltage Wireless Communications”. Proceedings of IEDM. San Francisco, CA: December 1996
A. Wood, C. Dragon, and W. Burger. “High Performance Silicon LDMOS Technology for 2GHz RF Power Amplifier Applications”. Proceeding of IEDM. San Francisco, CA: December 1996
B. Troyanovsky, F. Rotella, Z. Yu, R. Dutton, and J. Sato-Iwanga. “Large Signal Analysis of RF/ Microwave Devices with Parasitics Using Harmonic Balance Device Simulation”. SASIMI. Fukuoka, Japan: Nov. 1996
J. Cusak, S. Perlow, and B. Perlman. “Automatic Load Contour Mapping for Microwave Power Transistors”. Trans, on Microwave Theory and Techniques. Vol. MTT-22, No. 12, December 1974
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1998 Springer-Verlag/Wien
About this paper
Cite this paper
Rotella, F.M., Ma, G., Yu, Z., Dutton, R.W. (1998). Design Optimization of RF Power MOSFET’s Using Large Signal Analysis Device Simulation of Matching Networks. In: De Meyer, K., Biesemans, S. (eds) Simulation of Semiconductor Processes and Devices 1998. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6827-1_8
Download citation
DOI: https://doi.org/10.1007/978-3-7091-6827-1_8
Publisher Name: Springer, Vienna
Print ISBN: 978-3-7091-7415-9
Online ISBN: 978-3-7091-6827-1
eBook Packages: Springer Book Archive