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Efficient Algorithms for Three-Dimensional Etching and Deposition Simulation

  • W. Pyka
  • R. Martins
  • S. Selberherr
Conference paper

Abstract

The reduction of computing time without loss of accuracy is a very important task for three-dimensional process simulators. We present new approaches for fast and stable simulation of etching and deposition processes by introducing nonspherical structuring element algorithms.

Keywords

Metal Layer Stable Simulation Line Algorithm Deposition Simulation Redundant Operation 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. [1]
    E. Strasser and S. Selberherr, “Algorithms and Models for Cellular Based Topography Simulation”, IEEE Trans. Computer-Aided Design, vol. 14, no. 9, pp. 1104–1114, 1995.CrossRefGoogle Scholar
  2. [2]
    A. Myers, J. Doyle, and J. Abelson, “Monte Carlo Simulations of Magnetron Sputtering Particle Transport”, J. Vac. Sci. Technol. A, vol. 9, no. 3, pp. 614–618, 1991.CrossRefGoogle Scholar

Copyright information

© Springer-Verlag/Wien 1998

Authors and Affiliations

  • W. Pyka
    • 1
  • R. Martins
  • S. Selberherr
    • 1
  1. 1.Institute for MicroelectronicsViennaAustria

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