Abstract
This paper illustrates a common mesh implementation for use in both static and moving boundary process simulations. By using a single mesh server to support the different requirements of those two types of process simulations, it eliminates many interfaces between different simulators and simplifies the simulation process flow. Each simulation module only needs to communicate directly with the mesh program through a well defined common procedure interfaces. By providing a persistent and consistent storage of mesh and field data, the mesh server also greatly reduces the possibility of data loss when transported between simulation steps.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
D. Adalsteinsson, J. Sethian, “A Fast Level Set Method for Propagating Interfaces,”, J. Comp. Phys., vol. 118, 1995
Z. Hsiau, E. Kan, P. McVittie, R. Dutton, “Robust, Stable, and Accurate Boundary Movement for Physical Etching and Deposition Simulation”, IEEE Trans. Electron Devices, vol. 44, P.1375, September 1997
P. Conti, M. Tomizawa, A. Yoshi, “Generation of Oriented Three-Dimensional Delaunay Grids Suitable for the Control Volume Integration method,”, Int. J. Numer. Methods. Eng., vol. 37, p.3211, 1994
T. Chen, D. Yergeau, R. Dutton, “Efficient 3D Mesh Adaptation in Diffusion Simulation”, Proc. SISPAD 1996
DEPICT-2, Technology Modeling Associates, 1990.
V. Rao, T. Hughes, E. Kan, R. Dutton, “A New Numerical Formulation for Thermal Oxidation”, Proc. SISPAD 1997
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1998 Springer-Verlag/Wien
About this paper
Cite this paper
Chen, T., Yergeau, D.W., Dutton, R.W. (1998). A Common Mesh Implementation for Both Static and Moving Boundary Process Simulations. In: De Meyer, K., Biesemans, S. (eds) Simulation of Semiconductor Processes and Devices 1998. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6827-1_28
Download citation
DOI: https://doi.org/10.1007/978-3-7091-6827-1_28
Publisher Name: Springer, Vienna
Print ISBN: 978-3-7091-7415-9
Online ISBN: 978-3-7091-6827-1
eBook Packages: Springer Book Archive