Skip to main content
SpringerLink
Log in

3-D Diffusion Models for Chemically-Amplified Resists Using Massively Parallel Processors

  • Conference paper
Simulation of Semiconductor Devices and Processes

  • 281 Accesses

Abstract

Three-dimensional concentration dependent diffusions and simultaneous chemical reactions in chemically-amplified photoresists are simulated. Fickian, a linearly increasing diffusivity and an exponentially increasing diffusivity due to free volume increase with T-BOC are considered. Two different grid to processor mappings are proposed in implementing the simulator on massively parallel processors using the Scharfetter and Gummel discretization method. Experimental and simulation results which support an exponential diffusion coefficient are illustrated.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 39.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 54.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. R. Ferguson, Ph.D. Thesis, University of California, Berkeley, May 1991

    Google Scholar 

  2. T. Yoshimura et.al., J. Vac. Sci. Technol. B,Vol. 10, No. 6, 1992

    Google Scholar 

  3. W. Hinsberg et.al., SPIE Proceedings, Vol. 1925, 1993

    Google Scholar 

  4. D.L. Scharfetter, H.K. Gummel, IEEE Trans. on Electron Devices, Vol. ED-16, pp. 66–77, 1969

    Google Scholar 

  5. D. Webber et.al., IEEE Trans. on CAD, Vol. 10, pp. 1201–1209, 1991

    Google Scholar 

  6. E. Tomacruz et.al., International Workshop on VLSI Process and Device Modeling, pp. 20–21, 1993

    Book  Google Scholar 

  7. Z. Bozkus et.al., IEEE 4th Symp on the Frontiers of Massively Parallel Computation, pp. 100–107, 1992

    Google Scholar 

  8. M. Zuniga et.al., Submitted to Elec., Ion,and Photon Beams Conference,San Diego, CA, USA, 1993.

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Department of Electrical Engineering & Computer Sciences, University of California, Berkeley, CA, 94720, USA

    E. Tomacruz, M. Zuniga, A. Neureuther & A. Sangiovanni-Vicentelli

  2. Dipartimento di Elettronica, Informatica e Sistemistica, Università di Bologna, Viale Risorgimento 2, I-40136, Bologna, Italy

    R. Guerrieri

Authors
  1. E. Tomacruz
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. M. Zuniga
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. R. Guerrieri
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. A. Neureuther
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. A. Sangiovanni-Vicentelli
    View author publications

    You can also search for this author in PubMed Google Scholar

Editor information

Editors and Affiliations

  1. Institut für Mikroelektronik, Technische Universität Wien, Austria

    Siegfried Selberherr , Hannes Stippel  & Ernst Strasser ,  & 

Rights and permissions

Reprints and permissions

Copyright information

© 1993 Springer-Verlag Wien

About this paper

Cite this paper

Tomacruz, E., Zuniga, M., Guerrieri, R., Neureuther, A., Sangiovanni-Vicentelli, A. (1993). 3-D Diffusion Models for Chemically-Amplified Resists Using Massively Parallel Processors. In: Selberherr, S., Stippel, H., Strasser, E. (eds) Simulation of Semiconductor Devices and Processes. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6657-4_26

Download citation

  • DOI: https://doi.org/10.1007/978-3-7091-6657-4_26

  • Publisher Name: Springer, Vienna

  • Print ISBN: 978-3-7091-7372-5

  • Online ISBN: 978-3-7091-6657-4

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics

Search

Navigation