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Large Scale Thermal Mixed Mode Device and Circuit Simulation

  • J. Litsios
  • B. Schmithüsen
  • W. Fichtner
Conference paper

Abstract

The thermal mixed-mode capabilities of the device and circuit simulator Dessis are presented. The mode allows both electrical and thermal netlists to interconnect physical and circuit devices. As an example, the full electrothermal simulation of IGBT power module is presented.

Keywords

Circuit Model Physical Device Circuit Simulation Large Device Resistive Device 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. [1]
    J. Litsios, S. Müller, and W. Fichtner, “Mixed-mode multi-dimensional device and circuit simulation,” in SISDEP-5, (Vienna), pp. 129–132, Sept. 1993.Google Scholar
  2. [2]
    Robert Bosch GmbH, Reutlingen, Germany, BONSIM, Bosch Netzwerk — Simua-tion, Version 2.1, 1992.Google Scholar
  3. [3]
    B. H. Krabbenborg, H. de Graaf, A. J. Mouthan, H. Boesen, A. Bosma, and C. Tekin, “3d thermal/electrical simulation of breakdown in a bjt using a circuit simulator and layout-to-circuit extraction tool,” in SISDEP-5, (Vienna), pp. 57–60, Sept. 1993.Google Scholar

Copyright information

© Springer-Verlag Wien 1995

Authors and Affiliations

  • J. Litsios
    • 1
    • 2
  • B. Schmithüsen
    • 1
    • 2
  • W. Fichtner
    • 1
    • 2
  1. 1.Integrated Systems LaboratoryETH-ZürichSwitzerland
  2. 2.Integrated Systems EngineeringETH-ZürichSwitzerland

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