Accurate Modeling of Ti/TiN Thin Film Sputter Deposition Processes

  • H. Stippel
  • K. Reddy
Conference paper


An accurate and user friendly tool for the simulation of Ti/TiN sputter deposition processes has been developed. Simulations have been compared to SEM measurements, which exhibit excellent agreement for both, the collimated as well as the uncollimated case. A final test showed that this simulator is capable of predicting the deposited film on the collimator sidewalls.


Deposition Rate Graphical User Interface Flux Distribution Step Coverage User Friendly Tool 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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    Z. Lin. Simulation of Flux Distributions and Flat Substrate Deposition Profiles during Collimated Sputter Deposition. Center for Solid State Electronics Research, ASU, August 1994.Google Scholar

Copyright information

© Springer-Verlag Wien 1995

Authors and Affiliations

  • H. Stippel
    • 1
  • K. Reddy
    • 1
  1. 1.Corporate Technology Group, CDfM, UPDNational Semiconductor CorporationSanta ClaraUSA

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