Accurate Modeling of Ti/TiN Thin Film Sputter Deposition Processes
An accurate and user friendly tool for the simulation of Ti/TiN sputter deposition processes has been developed. Simulations have been compared to SEM measurements, which exhibit excellent agreement for both, the collimated as well as the uncollimated case. A final test showed that this simulator is capable of predicting the deposited film on the collimator sidewalls.
KeywordsDeposition Rate Graphical User Interface Flux Distribution Step Coverage User Friendly Tool
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