Abstract
For the realization of today’s wiring miniaturization, it is required to accurately estimate the interconnect wiring capacitance and the current density, which has not been so far adequately accomplished. We have developed SENECA, the three-dimensional wiring capacitance and current density simulation system with graphical user interface for easy and flexible operation. The realization of this graphical input interface made it possible to reduce the man power from more than three days work to less than 30 minutes for a practical structure. The comparison between simulation and experiment proves quite good agreement. Three important applications are given to show how SENECA is utilized for practical cases.
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References
R. Bauer et al., ”Capacitance Calculation of VLSI Multilevel Wiring Structures, ”Proc.VPAD Workshop, pp. 142–143, 1993.
R. Bauer et al., ”Calculating Coupling Capacitances of Three-Dimensional Interconnections, ”Proc. Solid State and Integrated Circuit Technology 92, pp.697–699, 1992.
K. Hoshino et al., ”Electromigration after Stress-induced Migration Test in Quarter-Micron Al Interconnects, ”Proc. IRPS, pp.252–255, 1994.
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© 1995 Springer-Verlag Wien
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Mukai, M. et al. (1995). The Simulation System for Three-Dimensional Capacitance and Current Density Calculation with a User Friendly GUI. In: Ryssel, H., Pichler, P. (eds) Simulation of Semiconductor Devices and Processes. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6619-2_35
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DOI: https://doi.org/10.1007/978-3-7091-6619-2_35
Publisher Name: Springer, Vienna
Print ISBN: 978-3-7091-7363-3
Online ISBN: 978-3-7091-6619-2
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